Lithography

LITHOGRAPHY ARTICLES



?200mm semiconductor manufacturing is here to stay

09/20/2016  Ted Shafer of ASML reports on the highlights from the ?200mm manufacturing session during SEMICON West, organized by the SEMI Secondary Equipment and Applications Special Interest Group.

Moore's Law did indeed stop at 28nm

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

Global semiconductor sales rebound in July

09/14/2016  The Semiconductor Industry Association announced worldwide sales of semiconductors reached $27.1 billion for the month of July 2016.

The future of Europe pitch their startups at SEMICON Europa's Innovation Village

09/14/2016  SEMI today announced that twenty-one start-ups have been selected to pitch to investors and exhibit their products at SEMICON Europa's INNOVATION VILLAGE in Grenoble, France at the Alpexpo from 25-27 October, 2016.

UC Berkeley, University of Minnesota professors recognized at annual SRC TECHCON Conference

09/13/2016  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, presented its highest honors Sept. 12 to professors from University of California, Berkeley and University of Minnesota at SRC's annual TECHCON conference in Austin, Texas.

M+W Group presents an integrated waste program for semiconductor facilities

09/08/2016  The global high-tech engineering and construction company M+W Group has presented current and future trends, as well as state of the art solutions, for an integrated approach to waste reduction in order to improve the sustainability of semiconductor fabs

SEMI recognizes UMC CEO Po Wen Yen for sustainable semiconductor manufacturing leadership

09/07/2016  SEMI today presented its industry leadership award for sustainable manufacturing to Po Wen Yen, CEO of United Microelectronics Corporation (UMC).

SEMICON Taiwan 2016 opens tomorrow; 43,000 attendees expected

09/06/2016  Upbeat about the growth prospects of Taiwan's semiconductor sector, SEMICON Taiwan 2016 features 600 exhibitors covering over 1,600 booths,and is expected to attract more than 43,000 visitors in three days.

Semiconductor industry icons to gather at SIA Award Dinner Nov. 10 in San Jose

09/02/2016  The Semiconductor Industry Association today announced more than a dozen semiconductor industry icons, leaders, and founders will come together at the annual SIA Award Dinner on Thursday, Nov. 10 in San Jose to celebrate the 25th anniversary of the Robert N. Noyce Award, the industry's highest honor.

Enabling industry collaboration to address critical ATE challenges

09/01/2016  For many years, the ATE industry has been challenged with controlling the cost of both production and development test by implementing innovative approaches and employing clever strategies (e.g., multi-site test implementation, DFT, etc.) to make “ends” meet, so to speak.

ASMC 2017 "Call for Papers" deadline is October 17

09/01/2016  SEMI announced today that the deadline for presenters to submit an abstract for the annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is October 17.

NXP Semiconductors joins Semiconductor Research Corporation

08/31/2016  Semiconductor Research Corporation (SRC), the university-research consortium for semiconductors and related technologies, today announced that NXP Semiconductors has signed an agreement to participate in multiple SRC research initiatives.

Industry veteran Lung Chu named president of SEMI China

08/30/2016  SEMI today announced the appointment of Lung Chu as president of SEMI China effective September 1, 2016.

TowerJazz and SMIC’s sales forecast to surge in 2016

08/23/2016  Total pure-play foundry market expected to jump 9% this year, up from 6% growth in 2015.

China's semiconductor industry worth $157.66B by 2020

08/22/2016  The China semiconductor industry is expected to reach $157.66 billion by 2020, at a CAGR of 12.8% between 2016 and 2020.

GlobalWafers to acquire SunEdison Semiconductor

08/18/2016  GlobalWafers Co., Ltd. and SunEdison Semiconductor Limited (NASDAQ:SEMI) announced today that they have entered into a definitive agreement for the acquisition by GlobalWafers of all of the outstanding ordinary shares of SunEdison Semiconductor in a transaction valued at US$683 million, including SunEdison Semiconductor outstanding net indebtedness.

KLA-Tencor announces new suite of reticle inspection technologies

08/17/2016  Today, KLA-Tencor Corporation (NASDAQ: KLAC) introduced three advanced reticle inspection systems that address 10nm and below mask technologies: the Teron 640, Teron SL655 and Reticle Decision Center (RDC).

Hexagonal boron nitride semiconductors enable cost-effective detection of neutron signals

08/16/2016  Texas Tech University researchers demonstrate hexagonal boron nitride semiconductors as a cost-effective alternative for inspecting overseas cargo containers entering US ports.

Tokyo Electron Limited joins Semiconductor Research Corporation

08/16/2016  Semiconductor Research Corporation today announced that Tokyo Electron Limited has joined SRC's Nanomanufacturing Materials and Processes initiative.

Seven Top-20 semiconductor suppliers show double-digit gains in 2Q16

08/15/2016  MediaTek and AMD register the fastest 2Q16/1Q16 growth rates of 32% and 23%, respectively.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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