Lithography

LITHOGRAPHY ARTICLES



How will graphene, the 2D wonder material, change the semiconductor industry?

09/19/2018  What materials innovation will the future bring?

Seven IC products to outpace total 16% IC market growth in 2018

09/18/2018  13 IC products forecast to show double-digit growth, led by a 39% surge in DRAM sales.

TowerJazz annual U.S. Technical Symposium to showcase its advanced analog specialty process offerings

09/18/2018  During TGS, the company will share its vision on industry megatrends: "Wireless Everything, Smart Everything, Green Everything" - and the means by which its analog specialty portfolio helps customers to differentiate their technology solutions.

eBeam Initiative surveys report 27% growth in photomasks delivered, continued confidence in EUV

09/17/2018  Results of annual Perceptions and Mask Makers' Surveys to be presented at SPIE Photomask Technology Conference; TEL joins eBeam Initiative.

New fabs invest over $220B; 2019 to mark all-time spending high

09/17/2018  Global fab equipment spending will increase 14 percent this year to US$62.8 billion and is expected to rise 7.5 percent, to US$67.5 billion, in 2019, marking the fourth consecutive year of spending growth and the highest investment year for fab equipment in the history of the industry, according to the latest World Fab Forecast Report published today by SEMI.

Industry growth: Still positive but varies by region

09/14/2018  Manufacturing activity continues to expand -- but at a slowing pace.

"Dreams Start Here" at SEMICON Japan 2018 in era of AI

09/11/2018  Japan is at the heart of the semiconductor industry as the era of artificial intelligence (AI) dawns. SEMICON Japan 2018 will highlight AI and SMART technologies in Japan's industry-leading event.

Worldwide semiconductor equipment billings reach $16.7B in second quarter 2018

09/10/2018  Worldwide semiconductor manufacturing equipment billings reached US$16.7 billion in the second quarter of 2018, 1 percent lower than the previous record quarter and 19 percent higher than the same quarter a year ago.

ASMC 2019 Call for Papers deadline is October 9, 2018

09/07/2018  Educate the industry about the latest in advanced processes and materials.

Top 10 semiconductor industry innovations

09/07/2018  Over the past three decades, most of the world’s innovations have centered largely on business models and involved iterative advances of existing technologies, with none matching the global impact of the top 10 semiconductor industry discoveries and advances, Dr. Morris Chang, founder of TSMC and the IC foundry model, said at SEMICON Taiwan 2018 this week.

Global semiconductor sales increase 17.4% year-to-year in July

09/06/2018  Global industry posts highest-ever monthly sales; year-to-year growth seen across all major semiconductor product categories and regional markets.

GLOBALFOUNDRIES CTO Gary Patton to deliver opening keynote at GSA Silicon Summit

09/06/2018   Dr. Gary Patton, Chief Technology Officer and Senior Vice President of Worldwide Research and Development at GLOBALFOUNDRIES, will deliver the opening keynote address at the inaugural GSA Silicon Summit – East, being held Tuesday, October 9 in Saratoga Springs, NY. 

Lattice Semiconductor appoints Steve Douglass as Corporate VP, R&D

09/05/2018  Lattice Semiconductor Corporation, a provider of customizable smart connectivity solutions, announced the appointment of Steve Douglass as the Company's Corporate Vice President, R&D, effective immediately.

Veeco announces changes to executive leadership team

09/05/2018  John Peeler to remain as Executive Chairman as Bill Miller becomes CEO on October 1, 2018.

SEMI Europe and AENEAS collaborate to support European electronics industry growth

09/05/2018  SEMI Europe and AENEAS today announced that they have signed a Memorandum of Understanding (MOU) to form a strategic partnership to support the European electronics industry's growth.

China's semiconductor fab capacity to reach 20% worldwide share in 2020

09/04/2018  The China IC Ecosystem Report, a comprehensive report for the IC manufacturing supply chain, reveals that front-end fab capacity in China will grow to account for 16 percent of the world's semiconductor fab capacity this year, a share that will increase to 20 percent by the end of 2020.

Micron announces $3B investment in U.S. for DRAM and NAND

08/29/2018  Micron Technology, Inc. today announced plans to invest $3 billion by 2030 to increase memory production at its plant in Manassas, Virginia, creating 1,100 new jobs roughly over the next decade.

SEMI testifies against third round of U.S. tariffs citing damage to semiconductor supply chain

08/27/2018  In testimony last week before a U.S. government interagency panel considering tariffs on $200 billion worth of Chinese goods, SEMI called for the removal of nearly 100 tariff lines, all of which cover items critical to the semiconductor manufacturing process, including materials and machines.

Cymer announces customer installation of latest light source for chip production at advanced nodes

08/27/2018  Cymer, a manufacturer of excimer lasers used in semiconductor manufacturing, today announced the first customer installation of its XLR 860ix light source, which is expected to be used in the production of chips at advanced logic and memory nodes.

North American semiconductor equipment industry posts July 2018 billings

08/24/2018  Global billings declined for the second month in a row, indicative of customer push-outs.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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