Lithography

LITHOGRAPHY ARTICLES



Controlling line-edge roughness in EUV resist with sturdy, small molecules

01/24/2007  Tokyo Ohka and Hitachi have demonstrated patterns with 28nm half-pitch resolution, with EUV resist made using small molecules that eliminate much line-edge roughness.

STS lands Pegasus order from Fraunhofer IZM

01/23/2007  Surface Technology Systems, announced that they won an EU tender for an MPX Pegasus system from the Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM.

Brion, Japan's TOOL pledge IC litho integration

01/18/2007  January 18, 2007 - Brion Technologies Inc. and Japan's TOOL Corp. have agred to combine TOOL's LAVIS layout visualization platform with Brion's Tachyon OPC and RET/OPC verification system, in a bid to help users more easily obtain litho simulation results without difficult and complex data preparation.

ASML quadruples profits in 4Q, sees strong business in 1H07

01/17/2007  January 17, 2006 - Lithography tool vendor ASML says its profits surged fourfold in 4Q06 from a year ago to about $265 million on record revenues, and expects to continue the good news with " healthy" order levels in 1Q07 and a yearlong ramp-up of 45nm volume manufacturing utilizing immersion lithography.

Heidelberg Instruments announces record order intake

01/12/2007  Heidelberg Instruments, a German manufacturer of maskless lithography systems, announced a record order intake in 2006.

Molecular Imprints ships system to memory maker

01/11/2007  Molecular Imprints Inc., an Austin, Texas, maker of nano-imprint lithography systems, announced the shipment of an Imprio 250 to a leading semiconductor memory manufacturer.

Stanford Magnetic Technology workshop not just about memories

01/09/2007  A Dec. 8 workshop at Stanford U.'s Center for Magnetic Nanotechnology on the patterning and imaging of magnetic nanostructures offered many looks at the future of data storage, including unique fabrication technology used to make heads with state-of-the art sensors, and the challenges of "bit patterned media." Several interesting presentations also delved into medical and biotech applications of magnetic nanoparticles.

UMC breaks ground on 300mm Fab 12B

01/08/2007  January 8, 2007 - UMC says it has begun construction of its 300mm Fab 12B in southern Taiwan's Tainan Science Park, and a R&D center on the site is entering the final stages of construction, on pace to be completed in March.

Equipment vendor launches new web site

01/04/2007  ClassOne Equipment, a Decatur, Ga. supplier of high quality, reconditioned semiconductor and nanotechnology equipment, announced the launch of its new web site.

DNP buying NEC's Fabserve photomask biz

01/03/2007  January 3, 2007 - In a move that may further juggle the top positions among photomask suppliers, NEC Electronics Corp. has agreed to sell its Fabserve photomask manufacturing subsidiary to Dai Nippon Printing Co. Ltd. for an undisclosed amount.

ASML illuminates a dry path to 40nm

01/02/2007  The ITRS plots a route to 45nm half-pitch through water immersion lithography for critical levels, but ASML is giving its customers an alternative by request -- one that employs familiar dry DUV exposure and the double pattern method being considered for 32nm.

Particles

01/01/2007  News snippets from the world of contamination control.

EV Group, Sawatec extend agreement

12/15/2006  EV Group (EVG), a St. Florian, Austria supplier of wafer-bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets and Sawatec, a manufacturer of advanced components and manual loaded instruments for photolithography, have signed a reseller agreement.

ISSYS Selects Wafer Bonder for MEMS

12/06/2006  Integrated Sensing Systems (ISSYS), Ypsilanti, MI, purchased and installed an AML Bonder from OAI, along with a mask aligner system. ISSYS purchased the stand-alone wafer bonder and complementary mask system to increase production of MEMS devices.

GenISys announces Layout LAB simulation software for MEMS

12/05/2006  Developers of MEMS and flat panel displays now have a powerful new development and productivity tool from GenISys GmbH, a leading-edge provider of software solutions for efficient processing optimization of microstructure fabrication.

EV Group, Sonix collaborating

12/01/2006  EV Group (EVG), a St. Florian, Austria, supplier of wafer-bonding and lithography equipment for the advanced packaging, MEMS and semiconductor markets, and Sonix Inc., a supplier of advanced acoustic NDT solutions for bonded wafers & MEMS, announced they are joining forces as Sonix selects EVG as their exclusive worldwide reseller/distributor of selected Sonix products.

DFM startup decloaks with tools, customers, design flow

11/27/2006  November 27, 2006 - After three years of behind-the-curtain development and joint work with several customers and foundries, Clear Shape Technologies Inc. has officially launched with an announcement of two flagship products, and a DFM-aware IC design flow resulting from a collaboration with Taiwan foundry United Microelectronics Corp. (UMC).

Heidelberg Instruments sells maskless litho system to Swedish lab

11/27/2006  Heidelberg Instruments announced the sale of an advanced DWL200 maskless laser lithography system to the Angstrom Microstructure Laboratory of the University of Uppsala, Sweden.

Nova tips 8% worker layoffs in biz balancing act

11/21/2006  November 21, 2006 - Days after a business unit reorg and executive shuffle, Nova Measuring Instruments Ltd. has announced layoffs of about 8% of its workforce in all parts of the organization, but mainly in R&D and operations and including management positions. The company will take a $300K charge in 4Q06 to cover termination expenses and other costs, but foresees saving $2 million in 2007.

Heidelberg Instruments sells direct write litho system to Chinese firm

11/17/2006  Heidelberg Instruments GmbH, a Heidelberg, Germany-based supplier of direct write laser lithography systems, announced the order for an advanced MW800fs system by Shenzhen New Way Electronic Co. Ltd. of Shenzhen, China.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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