11/24/2015  Trillium US Inc, headquartered in Clackamas, OR, has announced the acquisition of the Oxford Instruments - Austin division.

11/23/2015  Gyroscope and accelerometer production volumes are also growing, with the following CAGR: 7.9% and 1.6% respectively over the same period. Every sector will keep growing. So, what’s next?

11/19/2015  IDTechEx Printed Electronics USA 2015, held in Santa Clara, CA Nov 18-19, is one mega conference with eight co-located tracks ranging from sensor technology & wearables to IoT, energy harvesting & storage to electric vehicles, 3D printing and graphene.

11/17/2015  The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.

11/17/2015  Vacuum technology trends can be seen over the period of innovation defined by Moore’s Law, particularly in the areas of increasing shaft speed, management of pumping power, and the use computer modeling.

11/17/2015  Recent trends and future directions for wafer bonding are reviewed, with a focus on MEMS.

11/13/2015  Bosch Sensortec announced that its CEO, Dr. Stefan Finkbeiner, has been chosen by the MEMS & Sensors Industry Group to receive its prestigious MEMS/Sensors Lifetime Achievement Award.

11/13/2015  The advent of Internet-connected devices, the so-called Internet of Things (IoT), offers myriad opportunities and significant risks. It is our collective responsibility, as an industry, to secure the transport and storage of the data. Failing to properly secure the data risks turning the digital threat into a physical threat.

11/11/2015  GLOBALFOUNDRIES today announced the availability of FX-14, an ASIC offering built on the company's next-generation 14nm FinFET process technology.

11/11/2015  Gartner, Inc. forecasts that 6.4 billion connected things will be in use worldwide in 2016, up 30 percent from 2015, and will reach 20.8 billion by 2020.

11/11/2015  The world electronics market will consume over 121 billion analog ICs in 2015 and grow to over $56 billion by 2020.

11/10/2015  A recent report from Navigant Research suggests the global market for residential IoT devices will grow strongly through 2025.

11/10/2015  New research suggests wrapping silver nanowires with an ultrathin layer of graphene protects the structures from damage and could represent a key to realizing their commercial potential.

11/06/2015  GLOBALFOUNDRIES today announced it has demonstrated silicon success on the first AMD products using its most advanced 14nm FinFET process technology.

11/05/2015  China is quickly adding capacity in all flat-panel display (FPD) manufacturing segments.

11/03/2015  FEI Company and DCG Systems, Inc. announced an agreement where FEI willacquire DCG for $160 million in an all cash transaction.

11/03/2015  FEI announced the Helios G4 DualBeam series, which offers the highest throughput ultra-thin TEM lamella preparation for leading-edge semiconductor manufacturing and failure analysis applications.

11/03/2015  SIA announced worldwide sales of semiconductors reached $85.2 billion during the third quarter of 2015, an increase of 1.5 percent compared to the previous quarter.

11/03/2015  DCG Systems announced the release of EBIRCH, a technology for localizing shorts and other low-resistance faults that may reside in the interconnect structures or the polysilicon base layer of integrated circuits.

11/03/2015  Tsinghua Unigroup Ltd., a Chinese government-owned chipmaker will make a $600 million investment in Powertech Technology of Taiwan, according to multiple reports.