Manufacturing

MANUFACTURING ARTICLES



MEMS New Product Development: The importance of product validation

07/31/2013 

Product validation is an essential part of all successful MEMS new product developments. It is the process of testing products under various environmental, mechanical or electrical conditions to simulate life in an accelerated manner.

Driven by Apple and Samsung, light sensors achieve double-digit revenue growth

07/30/2013 

Light and proximity sensors in mobile handsets and tablets are set for expansive double-digit growth within a five-year period, thanks to increasing usage by electronic giants Samsung and Apple.

MediaTek introduces tablet SoC

07/29/2013 

MediaTek Inc., a  fabless semiconductor company for wireless communications and digital multimedia solutions, today announced its breakthrough MT8135 system-on-chip (SoC) for high-end tablets.

New NIST nanoscale indenter takes novel approach to measuring surface properties

07/25/2013 

Researchers from the National Institute of Standards and Technology (NIST) and the University of North Carolina have demonstrated a new design for an instrument, a "instrumented nanoscale indenter," that makes sensitive measurements of the mechanical properties of thin films -- ranging from auto body coatings to microelectronic devices -- and biomaterials.

Micralyne and Adament to develop MEMS-based fiber-optic subsystems

07/24/2013 

Companies announce alliance to bring high-performance sensors to market.

Scrubber developed for POU abatement of wet bench gases

07/18/2013 

DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications.

Installed capacity for 300mm wafer processing to rise to 70% of total capacity by 2017

07/02/2013 

Capacity for 200mm wafers forecast to slip more than 10 points during same period.

MEMS for mobile industry will reach $6.4B by 2018

06/20/2013 

Market demand for new sensors will lead to a $6.4B market by 2018.

Bosch and STM hold joint honors as No. 1 MEMS suppliers for 2012

06/11/2013 

For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian STMicroelectronics ending up evenly splitting the title of No. 1 supplier for the year.

Alchimer to collaborate with imec on advanced nano-interconnect technologies

06/11/2013 

In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs (>8) without experiencing defects, voids, or low reliability.

Necessary attributes of a MEMS engineer for new product development

06/10/2013 

In the development of new MEMS products, the team is the most important factor.

Fab equipment spending: 23% growth for 2014

06/04/2013 

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

Bosch reaches 3 billion sensor milestone

06/04/2013 

Since the start of production in 1995, Bosch has manufactured well in excess of three billion MEMS sensors.

Leti to present latest R&D results in MEMS at Transducers’ 2013 in Barcelona

05/29/2013 

CEA-Leti will host a workshop for industrial companies to present its latest advances in MEMS and an overview of the success of its recent MEMS startup, Wavelens, during Transducers’ 2013 and Eurosensors XXVII in Barcelona, Spain.

Combo MEMS inertial sensors report brisk growth in automotive market

05/13/2013 

Combo MEMS sensors for automotive applications are off to another exhilarating ride this year as revenue continues to climb, spurred by rapidly accelerating use in car safety systems.

Leading MEMS microphone suppliers ride Apple’s gravy train to the top

05/01/2013 

Once again demonstrating Apple’s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical systems microphones were those that provided devices for iPhones and iPads.

Kurt Petersen, MEMS industry pioneer and technology vision, joins IMT board of directors

04/30/2013 

IMT, the largest pure-play MEMS foundry in the US, announced today the appointment of MEMS industry pioneer and technology visionary Dr. Kurt Petersen to the IMT board of directors.

TSMC

04/26/2013 

TSMC

M2M Forum 2013 explores MEMS and the future of medical devices

04/23/2013 

MEMS Industry Group (MIG), a global industry organization with more than 140 member-companies and partners, will welcome micro-electromechanical systems (MEMS), medical industry and academic experts to Cambridge, Mass. for Member-to-Member (M2M) Forum 2013, a conference on the MEMS connection to advancements in healthcare, medical and biomedical applications.

Automotive, wireless applications to drive pressure sensors to become top-selling MEMS devices

04/22/2013 

MEMS pressure sensors will achieve accelerated growth this year and become the leading type of MEMS device, driven by increasing use in automotive and the fast-growing handset space, according to insights from the IHS iSuppli MEMS & Sensors Service from information and analytics provider IHS.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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