Manufacturing

MANUFACTURING ARTICLES



IEDM 2012 slideshow: Sneak preview of 14 conference papers

12/04/2012 

We've scanned the entire conference program for next week's 58th annual IEEE International Electron Devices Meeting (IEDM), to present a quick sampling of some of the more intriguing papers.

EV Group completes cleanroom expansion, opens new R&D labs

11/28/2012 

EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.

Antenna-on-a-chip promises faster light processing with silicon photonics

11/19/2012 

Researchers from Rice U. say they have developed a micron-scale spatial light modulator (SLM) built on SOI that runs orders-of-magnitude faster than its siblings used in sensing and imaging devices.

Semiconductor equipment demand: Shades of 2009?

11/16/2012 

The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.

Brewer Science introduces CNT inks for printed electronics

11/15/2012 

Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.

MIPI Alliance forms group to study sensor integration in mobile systems

11/12/2012 

MIPI Alliance has formed an open "Birds of a Feather" (BoF) group that will investigate the requirements related to integrating sensors into mobile systems. The group will address challenges facing the sensor and wireless markets.

X-Fab takes majority stake in MFI, widens MEMS portfolio to support growth push

11/01/2012 

X-Fab Silicon Foundries says it has become the majority shareholder in German MEMS Foundry Itzehoe GmbH (MFI), the latest in a series of recent moves to raise its profile as a top MEMS foundry.

Semi equipment demand still sinking

10/22/2012 

In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.

SEMI adds session, extends abstract deadline for China chip conference

10/16/2012 

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.

GSA forms technology steering committee to guide working groups

10/16/2012 

The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."

From fuzzy to focused: Phase I in project development

10/12/2012 

Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.

Europe to unite research efforts in Silicon Europe cluster alliance

10/08/2012 

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”

Analyst: Fab spending softness 2012 extending into 2013

10/04/2012 

Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.

Japan's semiconductor industry: Fabs, equipment, and materials

10/03/2012 

Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy,  the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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