Manufacturing

MANUFACTURING ARTICLES



GlobalFoundries to fab Sand 9's MEMS timing products

10/02/2012 

Sand 9 is partnering with GlobalFoundries for high-volume manufacturing of its microelectromechanical systems (MEMS) timing technology, which incorporates silicon-on-insulator (SOI) and through-silicon vias (TSV).

Micro-rheometer, microdevice adsorbtion get nods in Sandia student MEMS design contest

09/27/2012 

A device that measures very thin quantities of liquid, such as the synovial fluid in knee joints, and a device that measures change in mass when a microdevice adsorbs small amounts of material, earned top honors in Sandia National Labs' annual student MEMS design contest.

X-Fab investing $50M in MEMS business, eyes top-three ranking

09/26/2012 

X-Fab Silicon Foundries says it will invest more than $50M over the next three years in its microelectromechanical systems (MEMS) operations, aiming to grow the business to become among the top MEMS foundries worldwide.

Chip demand still sliding, hopes for soft 3Q landing and recovery

09/21/2012 

Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.

CrossFiber buys assets of MEMS photonic switch maker OMM

09/20/2012 

CrossFiber, a San Diego, CA maker of photonic switches that incorporate microelectromechanical system (MEMS) technology, has acquired substantially all the assets of 2D MEMS switch firm OMM.

X-Fab offering MEMS 3D inertial sensor process

09/19/2012 

X-Fab Silicon Foundries has debuted an open-platform MEMS 3D inertial sensor process, what it claims is the first to be made available directly from a high-volume pure-play foundry.

IBM demos high-performance CMOS on flexible plastic substrates

09/18/2012 

At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.

CrossFiber lands $13M funding for 3D MEMS photonics switches

09/17/2012 

CrossFiber, a San Diego, CA maker of photonic switches that incorporate MEMS technology, says it has completed the final tranche of a Series D round of funding, which closes totaling $13.4 million.

IEDM unveils 2012 program highlights

09/17/2012 

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.

Singapore IME, MOSIS to offer silicon photonics wafer prototyping service

09/04/2012 

Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics.

Technology licensing company Rambus restructures, creates CTO role

08/23/2012 

Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.

Attend the MEMS & NANO live seminar program in the UK

08/23/2012 

The MEMS & NANO free 2-day conference, presented by JEMI, Nanotechnology KTN, and MANCEF, will cover advances in MEMS and nanoscale processes for electronics, industrial and biomedical applications.

Wafer-level optics maker orders Heidelberg Instruments lithography tool

08/21/2012 

Heptagon, wafer-level optics maker, ordered an advanced DWL 2000 maskless lithography system from Heidelberg Instruments. The tool has sophisticated Gray Scale Exposure capability.

How to participate in SensorsCon 2013

08/20/2012 

The second annual SensorsCon 2013, the conference for Sensors Technology, Design and Applications, March 6, 2013, Techmart Center, Santa Clara, CA, is accepting applications for exhibitors, sponsors and speakers.

Focus on MEMS at SEMICON Taiwan

08/20/2012 

SEMICON Taiwan 2012, held September 5-7, will feature both Taiwan MEMS suppliers and global MEMS elites -- including Asia Pacific Microsystems, Freescale, InvenSense, and STMicroelectronics -- who will discuss innovation in MEMS design, manufacture, packaging, testing and equipment.

Tessera changes CFO, Neely brings high-tech experience

08/16/2012 

Tessera appointed Rick Neely, Jr. as EVP and CFO, responsible for the company

Attend MEMS Executive Congress: Keynotes on MEMS in our world

08/13/2012 

MEMS Executive Congress 2012 in Scottsdale, AZ, will host keynotes from Ajith Amerasekera, TI Fellow, IEEE Fellow, in Texas Instruments’ Kilby Labs, who will discuss how immersive intelligent systems will change the management of our cities, buildings, personal life, health, transportation, safety and security; and Robert Brunner, founder, creative director and partner, Ammunition, who will explore the critical connection between brand identity and connection to consumers.

Laser nanofabrication for mass production at the nanoscale

08/10/2012 

Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.

NIST promotes lab-on-chip testing standard dev

08/08/2012 

Standardized testing and measurement methods, NIST argues, will enable MEMS lab-on-chip manufacturers to accurately determine important physical characteristics of LOC devices such as dimensions, electrical surface properties, and fluid flow rates and temperatures. These must be calculable at all stages of production, from processing of raw materials to final rollout of products.

Knowles, Vectron partner with SiTime to grow MEMS timing devices

08/02/2012 

Vectron International and Knowles Electronics entered into a strategic partnership with SiTime Corporation, aiming to grow MEMS timing components in the frequency control products market.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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