Manufacturing

MANUFACTURING ARTICLES



MEMS suppliers, equipment maker join MIG Hall of Fame

05/14/2012 

MEMS Industry Group (MIG) inducted 3 members into its MIG Hall of Fame, from EV Group (EVG), Acuity Inc. and Analog Devices Inc. (ADI).

Sensory Swarms and MEMS roadmaps on docket at MEPTEC MEMS Technology Symposium

05/10/2012 

MEPTEC will host its 10th Annual MEMS Technology Symposium in San Jose, CA. Keynotes cover “sensory swarms” and motion interfaces, and sessions will cover MEMS roadmaps; design, manufacturing, and test of MEMS; MEMS architectures and uses, and more.

ST’s MEMS revenues jump 82% in 2011, but TI holds onto #1 spot

05/09/2012 

The top 3 MEMS manufacturers by revenue -- Texas Instruments, Hewlett Packard, and Bosch -- fought for market share in 2011, but #4, STMicroelectronics, experienced the biggest revenue jump year-to-year.

Baolab expands NEMS fab technology in pursuit of CMOS-integrated IMU

05/08/2012 

Baolab Microsystems will modify the structures of its 3D NanoCompass to build a range of other motion sensors, with the end-goal of low-cost, smart, reconfigurable inertial measurement units (IMUs).

memsstar appoints CEO with semiconductor and packaging experience

05/08/2012 

memsstar Limited, deposition and etch equipment supplier to the MEMS and semiconductor industries, named Mike Thompson as CEO.

MEMS formed with laser, diamond combo

05/07/2012 

Western Michigan University developed a device combining a laser and diamond cutting system, enabling users to process hard, brittle materials that are difficult to machine. Initial applications include MEMS manufacturing, and other fabrication on semiconductor materials.

Hanking builds MEMS fab in China

05/04/2012 

Hanking Industrial Group Co., Ltd., broke ground on a micro electro mechanical system (MEMS) manufacturing campus in Fushun City, China, outside of Shenyang.

Dolomite, LioniX partner on microfluidics design, manufacturing, more

05/02/2012 

Dolomite and LioniX BV formed a partnership covering the design, development, fabrication, and distribution of microfluidic devices and systems.

SST Book Review: Energy Harvesting for Autonomous Systems

04/30/2012 

Contributing editor Steve Groothuis reviews a book titled “Energy Harvesting for Autonomous Systems (Smart Materials, Structures, and Systems).” The book highlights the progression from the basic principles behind energy harvesting to the comprehensive systems that control the sensing, actuation, and transmission of those devices. 

MEI semiconductor wet process tools built to prevent contamination

04/27/2012 

MEI uses Vycom Flametec PVC-C for chemical rinse tanks and other wafer-contacting elements of its process tools, reducing tool-based contamination and protecting fab workers. Bill McGinty, MEI operations manager, discusses the benefits the new-generation plastic for semiconductor fab tools.

CNSE STC designated trusted foundry for DOD Defense Microelectronics Agency

04/26/2012 

The College of Nanoscale Science and Engineering's (CNSE) Smart System Technology and Commercialization Center of Excellence (STC), Canandaigua, NY, was designated as a Trusted Foundry by the US Department of Defense's Defense Microelectronics Agency.

Magnetic MEMS under development at Silex thanks to new research grant

04/25/2012 

Silex Microsystems, a pure-play MEMS foundry, will develop ferromagnetic materials for next-generation MEMS devices, under a new VINNOVA research grant worth nearly 3 million Swedish Kronor.

Silex Microsystems adds board member with new markets eye

04/19/2012 

Silex Microsystems named Fredrik Jönsson, CEO of Beijer Electronics, to its Board of Directors.  Beijer Electronics provides industrial automation and data communications solutions.

Texas Instruments (TI, TXN) names top suppliers

04/19/2012 

Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.

ASMC will focus on productivity and technology challenges

04/18/2012 

The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.

Laser lithography tool uses piezo stage to construct submicron features

04/17/2012 

The new laser lithography tool from Nanoscribe GmbH produces complex 3D submicron structures up to 1mm with 150nm widths, boasting full automation and precise repeatability. It is based on a 3-axis piezo nano-positioning stage from PI (Physik Instrumente).

Micrel MEMS fab graded 98% following multi-million-dollar expansion

04/16/2012 

Micrel Inc. (NASDAQ:MCRL) received a 98% performance rating for its services and materials to a top-20 global MEMS designer and manufacturer in in a report covering Q4 2011.

Conference Report: MRS Spring 2012, Day 5

04/16/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: electronic skin, energy storage with nanowires, printable inks, gas sensing, inkjet printing, semiconductor polymers for organic devices, CNTs, OFETs, touch screen fabrics, and the coffee breaks.

Conference Report: MRS Spring 2012, Day 3

04/12/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- ? dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.

Smallest 3-axis MEMS gyroscope: Teardown report released

04/11/2012 

Research and Markets released the "ST L3G3250A 3-axis MEMS Gyroscope Reverse Costing Analysis" report, providing a teardown of STMicroelectronics’ MEMS gyroscope in an LGA package.




WEBCASTS



Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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