Manufacturing

MANUFACTURING ARTICLES



Vacuum pumps improve throughput by 90% with new rotary design

04/10/2012 

Edwards Limited uncrated the STP-iXR1606 series magnetically-levitated turbo-molecular pumps (TMP) with fully integrated onboard controllers. Its new rotary design improves throughput by about 40% at high gas flow rates; nearly 90% percent in maximum gas flow.

Attend joint sessions at VLSI Technology and Circuits

04/10/2012 

The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.

Coventor boosts predictive process modeling for advanced device nodes

04/09/2012 

Coventor launched SEMulator3D 2012, featuring improved predictive process modeling tools with increased capacity, speed, and automation for leading-edge process technology nodes.

MIT's maskless MEMS wafer patterning promises cheaper, higher-mix manufacturing

04/05/2012 

MIT researchers say new maskless patterning and other MEMS-targeted fab techniques, and improved CAD tools, would break through limitations on MEMS adoption.

Conference Report: MEMS Executive Congress Europe

04/02/2012 

Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe, which was held March 20th, in Zurich, Switzerland.

 

SEMICON West heralds 22nm, EUVL, 450mm, mobile electronics speakers

04/02/2012 

Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.

SUSS buys Tamarack for lithography, laser structuring lines

03/30/2012 

SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.

Field Report: Sensors in Design 2012

03/29/2012 

Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.

Bosch's Akustica enters analog MEMS sector with 2-chip offering

03/28/2012 

Akustica, known for its monolithic single-chip digital MEMS devices, introduced its first analog 2-chip MEMS microphone for mobile handsets, the AKU340.

TSMC, GLOBALFOUNDRIES fab InvenSense's CMOS-MEMS chips

03/27/2012 

MEMS company InvenSense Inc. (NYSE:INVN) announced dual-source capability for its CMOS-MEMS supply from semiconductor foundries TSMC and GLOBALFOUNDRIES.

Vistec e-beam lithography tool installed for nano/microelectronics research in Finland

03/26/2012 

Micronova Nanofabrication Centre selected a Vistec Lithography e-beam litho system for its nanotechnology laboratory in Finland. The litho tool will be used for nanoelectronics, nanofabrication, microelectronics, nanophotonics and microfabrication research in a multi-user environment.

Top MEMS suppliers near $1 billion in sales

03/26/2012 

The market for MEMS grew 17% to $10.2 billion in 2011, according to Yole Développement. The top 2 suppliers -- Texas Instruments (TXN, TI) and STMicroelectronics (STM, ST) -- neared $1 billion in sales each.

SEMICON Europa 2012 seeks presenters

03/23/2012 

SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.

SPTS sends dry MEMS etch tool to China research institute

03/21/2012 

SPTS Technologies delivered its first VHF etch system in China, installing a Primaxx Monarch 3 at the Shanghai Institute of Microsystem and Information Technology for a MEMS accelerometer development project.

SUSS combines resist coat and develop platforms

03/19/2012 

SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.

CVD Equipment doubles manufacturing space with new NY facility

03/19/2012 

CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.

MEMS supply chain stronger 1 year after Japanese earthquake

03/16/2012 

The Great East Japan Earthquake, March 11, 2011 off Sendai, was "a Darwinian event" for the MEMS market. The MEMS supply chain came out of the disaster much richer, more diverse, and better positioned for growth, shows the IHS iSuppli MEMS & Sensors Service.

MATHESON incorporates RFID, pressure monitoring in compressed gas control system

03/14/2012 

MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.

Qualtre adds MEMS-industry veteran for customer/partner development

03/12/2012 

Qualtré appointed Mark Laich as VP of sales and business development, responsible for customer and partner development as Qualtré launches its latest iteration of inertial sensing technologies.

Attend Image Sensors 2012 in London

03/09/2012 

Image Sensors 2012, March 20-22 in London, will highlight the emergence of CMOS image sensors against those based on TFTs, applications possibilities for 3D cameras and non-visual spectrum cameras, and more.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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