01/03/2012 

Enpirion, Inc. entered into a strategic partnership agreement with JiangyinChangdian Advanced Packaging Co., Ltd. (JCAP) for the manufacturing of silicon-based magnetics utilizing Enpirion's proprietary micro electronic magnetic silicon (MEMS) technology.

12/30/2011 

United Microelectronics Corporation (UMC) launched the A+ technology platform, a specialized 0.11

12/30/2011 

Tegal sold over 30 patents from the NLD portfolio, Lots 1-3, covering pulsed-chemical vapor deposition (CVD), plasma-enhanced atomic-layer deposition (PEALD) and NLD.

12/29/2011 

The updated "Garment System Considerations for Cleanrooms and Other Controlled Environments" document includes new sections on measuring footwear, frocks and other garments, as well as a new subsection for tracking system use, such as RFID chips and barcodes.

12/26/2011 

Yole studies the evolution of inertial MEMS and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS." The report considers 23 MEMS devices.

12/21/2011 

Boston Micromachines Corporation will use a NASA contract to develop better microfabrication processes for deformable mirrors, which will be used in exoplanet imaging research.

12/13/2011 

DelfMEMS SA named Tronics as its micro electro mechanical systems (MEMS) foundry partner. Tronics will manufacture RF MEMS switches for DelfMEMS, with high-capacity runs starting in 2012.

12/12/2011 

SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.

12/08/2011 

Imec and Holst Centre micromachined a vibration-energy harvester with 489µW output power, using piezoelectric material in a MEMS cantilever. The team presented results at IEEE's International Electron Devices Meeting (IEDM) this week in Washington DC.

12/07/2011 

imec is presenting a record number of 17 papers at the IEEE International Electron Device Meeting (IEDM), ending today in Washington, DC.

12/07/2011 

Semiconductor Research Corporation (SRC), university-research consortium for semiconductors and related technologies, is working with Cornell University researchers to develop on-chip silicon technologies for mobile devices. The aim is a micro-mechanical resonator for RF MEMS.

12/05/2011 

Applied Materials Inc. (AMAT) launched the Applied Producer Optiva chemical vapor deposition (CVD) system for back-side-illuminated (BSI) image sensor manufacturing. It deposits low-temperature conformal films that boost the low-light performance of the sensor while improving its durability.

12/02/2011 

A multi-institution team has produced a cobalt/iron alloy that could be the basis for a new class of sensors and micromechanical devices controlled by magnetism. The alloy does not use rare-earth elements to achieve its properties.

12/01/2011 

STMicroelectronics (NYSE:STM), MEMS maker, named a winner in its 2011 iNEMO Campus Design Contest in China: Sky Worker Team 1 from Tsinghua University. ST operates the open competition in China and Taiwan, and the US.

12/01/2011 

ULVAC Inc. developed the ENTRONTM-EX2 W300 CVD-Ni/CVD-Co system for CVD-Ni and CVD-Co silicidation of 3D semiconductor gates and MEMS. The system is a response to a semiconductor industry transition from PVD to CVD in advanced 3D gate structure film step coverage, ULVAC reports.

11/28/2011 

Innovative Solutions Bulgaria Ltd. acquired Bulgaria’s largest MEMS fab, built north of Sofia in 2004. This new facility provides space to expand production capacity of AFM products.

11/21/2011 

University of Wisconsin-Madison engineers and physicists have integrated highly piezoelectric single-crystal material onto silicon to fabricate a low-voltage MEMS for communications, energy harvesting, sensing, actuators and other applications.

11/21/2011 

System Plus Consulting releases MEMS CoSim+ V3.0, a comprehensive simulation tool for the non-standard manufacturing process of MEMS sensors.

11/17/2011 

Specialty foundry TowerJazz signed a non-exclusive memorandum of understanding (MOU) with a European entity to transfer processes and projects to India and Brazil, including semiconductor and MEMS devices.

11/16/2011 

Microelectronics experts at Aurrion Inc. are seeking to develop military microelectronics technology for optoelectronic microsystems, under terms of a $13.9 million DARPA contract.