Manufacturing

MANUFACTURING ARTICLES



US atmospheric plasma tech company joins Precision Mechatronics

11/16/2011 

Precision Mechatronics Pty Ltd acquired Surfx Technologies, which specializes in high-speed atmospheric plasma technology for MEMS, microfluidics, semiconductors, solar cells, medical devices, and other manufacturing.

Thin-film ferroelectric sensor challenges microbolometers

11/15/2011 

Optex Systems entered into an MoU with Bridge Semiconductor Corporation to develop and sell thermal systems for a range of military applications. The thin-film ferroelectric technology aims to displace microbolometers for uncooled thermal sensing applications.

NSF funds MEMS made with cellulose nanocrystals

11/14/2011 

Auburn University chemical engineering researchers William R. Ashurst and Virginia A. Davis were awarded a National Science Foundation grant to investigate cellulose nanocrystals in MEMS.

Measurement Specialties amends credit facility

11/09/2011 

Measurement Specialties Inc. (NASDAQ:MEAS), sensor designer and manufacturer, entered into an amendment to its senior secured credit facility dated June 1, 2010, among JPMorgan Chase Bank N.A. and certain other parties.

Multiple-memory material garners Ontario entrepreneurship award

11/09/2011 

The Ontario Centres of Excellence gave the Martin Walmsley Fellowship for Technological Entrepreneurship award, totalling $50,000, to Innovative Processing Technologies Inc.

Sand 9 is halfway to $6M funding goal

11/04/2011 

Sand 9, a MEMS oscillator developer, reports that it has raised $3,095,262 of its 6,190,528 equity funding round, in a recent SEC filing.

Micronit launches MEMS division

11/02/2011 

Micronit opened its MEMS division, specializing in the design, prototyping and manufacturing of MEMS devices and wafers based on glass and silicon.

HUN sells MEMS printing fab technology to DDD

11/01/2011 

Huntsman Corporation (NYSE:HUN) Advanced Materials division sold its stereolithography resin and Digitalis MEMS manufacturing machine businesses to 3D Systems Corporation (NYSE:DDD) for $41 million in cash.

Micrel ramps MEMS manufacturing in San Jose foundry

11/01/2011 

Micrel Inc. (Nasdaq:MCRL) has begun manufacturing MEMS at its San Jose, CA wafer foundry operations, offering 6" wafer fab and tools to produce advanced MEMS devices.

ScanNano partners with STMicroelectronics on MEMS devices

10/27/2011 

Helsinki-based ScanNano,a private Finnish R&D firm that specializes in MEMS technology at the nanoscale, has partnered with STMicroelectronics with the goal of combining RF MEMS and CMOS.

NIST, CU microchip combines microfluidics and magnetism without power drain

10/24/2011 

Researchers from NIST and University of Colorado Boulder developed a low-power microchip combining microfluidics and magnetic switches to trap and transport magnetic beads.

MIT etches MEMS structures with glass stamp

10/19/2011 

MIT researchers developed a glass-stamp-based technique that helps fabricate lab-on-chip sensors at a lower cost than e-beam lithography and in a more reproducible manner than nanoimprint lithography.

mPhase develops MEMS membrane at Argonne Labs

10/14/2011 

mPhase Technologies was granted access to the technical facilities at the Center for Nanoscale Materials, Argonne National Labs, for work on its MEMS Smart silicon membrane, a key component of the mPhase Smart NanoBattery.

X-FAB, Senodia ramp MEMS gyroscope production

10/13/2011 

X-FAB Silicon Foundries Group and Senodia Technologies (Shanghai) Co., Ltd today announced they have concluded development and are ramping production of microelectromechanical system (MEMS) gyroscopes for high-volume consumer applications.

Flat silicon wafer shipments will pick up in 2012, 2013

10/12/2011 

While the market has currently softened, early-2011 momentum will carry the year's semiconductor silicon sales to a higher total than 2010, said Stanley T. Myers, president and CEO of SEMI, noting the figures are an industry record. Growth will continue at "modest levels" through 2013.

VTI Technologies sold to Murata Manufacturing

10/11/2011 

EQT III will sell VTI Technologies, leading independent designer and manufacturer of high-performance MEMS sensors, to the publicly listed Japanese electronic components company Murata Manufacturing.

Custom SOI wafers debut from IQE for MEMS, related manufacturing

10/11/2011 

Wafer supplier IQE released a customizable range of silicon on insulator (SOI) products that IQE reports afford improved thickness and doping control.

Imec demos faster HBTs in SiGe for wireless, imaging

10/10/2011 

Imec says it has developed a fT/fMAX 245GHz/450GHz SiGe:C heterojunction bipolar transistor (HBT) device, useful for future high-volume millimeter-wave circuits in various applications.

Present on MEMS manufacturing, inspection

10/05/2011 

Submit an abstract now to present at a group of co-located micro/nano manufacturing conferences. MM Live USA 2012 will co-locate with MEMS Live USA and NANO Live USA in Rosemont, IL, March 7-8.

memsstar expands in Silicon Glen

10/04/2011 

The maturing MEMS market and increased adoption of secondary equipment for semiconductor manufacturing have led deposition and etch tool supplier memsstar Limited to expand in Livingston, Scotland. memsstar added new positions in logistics, administration, and skilled and semi-skilled engineering to its jobs roster in conjunction with the expansion.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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