04/05/2017  A recent study, affiliated with UNIST has created a three-dimensional, tactile sensor that could detect wide pressure ranges from human body weight to a finger touch. This new sensor with transparent features is capable of generating an electrical signal based on the sensed touch actions, also, consumes far less electricity than conventional pressure sensors.

04/04/2017  Year-to-year sales increased by double digits across most regional markets, with the China and Americas markets showing particularly strong growth.

03/31/2017  Series of nine white papers mark milestone effort for strategic initiative that identifies challenges and solutions to help guide future roadmaps.

03/30/2017  Leti, a research institute of CEA Tech, is marking its 50th anniversary this year during industry events and workshops in Grenoble, Tokyo, and Taipei and at both SEMICON West and IEDM 2017 in San Francisco.

03/29/2017  Intel Corporation today announced the appointment of Aicha S. Evans as chief strategy officer, effective immediately.

03/27/2017  The selection recognizes Dr. Kim's leadership and strategic vision, as well as his undeniable impact in the semiconductor industries.

03/24/2017  Glass can bend over and over again on a nanoscale.

03/23/2017  Intel Corporation today announced that Omar Ishrak and Greg Smith have been elected to Intel’s board of directors.

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

03/08/2017  ST and Eutelsat complete development of chip for Eutelsat's next-generation SmartLNB.

03/02/2017  Manufacturers, suppliers and academia gather to understand the road ahead.

03/01/2017  ULVAC Technologies, Inc. has been selected by a global MEMS inertial sensor manufacturer to deliver an ULVAC ENVIRO-1Xa advanced plasma ashing system for running critical low-temp descum processes and high-temp bulk photoresist strip processes.

02/27/2017  Rice University researchers simulate two-dimensional hybrids for optoelectronics.

02/22/2017  Process uses household inkjet printer without soldering to create 750nm-thin elastomeric sheet.

02/21/2017  Today, the research and innovation hub in nanoelectronics and digital technology imec, and the Flemish Government announced a new, 5-year strategic commitment that aims at strengthening the pioneering role of Flanders' renowned research hub.

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

02/07/2017  Innovative tag is the thinnest and mechanically most robust technology compatible to ISO protocols.

01/27/2017  What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.

01/25/2017  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

01/25/2017  ams, a worldwide supplier of high-performance sensor and analog solutions, announces the completion of the transaction to acquire 100% of the shares in Heptagon and related capital.