Manufacturing

MANUFACTURING ARTICLES



Sensor accuracy: Critical metric in automotive, industrial, consumer markets

02/13/2019  As group vice president of the Analog & MEMS Group and general manager of the MEMS Sensor division at STMicroelectronics, Andrea Onetti brings nearly three decades of experience in MEMS, sensors and audio systems to his leadership role at one of the world’s most successful electronics and semiconductor manufacturers.

IDT and Telink Semiconductor announce partnership on integrated sensor platforms

02/08/2019  Leveraging respective leadership technologies in sensors and IoT connectivity, Integrated Device Technology, Inc. (IDT) and Telink Semiconductor are announcing a partnership to create connected and integrated sensor platforms for IoT applications.

John Chong of Kionix named Chair of MEMS & Sensors Industry Group governing council

02/06/2019  SEMI today announced the appointment of John Chong, vice president of product and business development at MEMS manufacturer Kionix, as Governing Council chair of the SEMI-MEMS & Sensors Industry Group.

MEMS & Sensors Technical Congress highlights automotive market, emerging MEMS technologies

02/06/2019  This year’s MEMS & Sensors Technical Congress(MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging MEMS technologies, and an exploration of integration standards.

Researchers report advances in stretchable semiconductors, integrated electronics

02/05/2019  Researchers from the University of Houston have reported significant advances in stretchable electronics, moving the field closer to commercialization.

CEA-Leti builds prototype of next-generation mid-infrared optical sensors for portable device

02/05/2019  CEA-Leti today announced it has prototyped a next-generation optical chemical sensor using mid-infrared silicon photonics that can be integrated in smartphones and other portable devices.

It’s chilly!

01/16/2019  4Q'18 world electronic supply chain: Slowing electronic equipment growth

Development of MEMS sensor chip equipped with ultra-high quality diamond cantilevers

12/20/2018  Progress in the development of highly reliable and sensitive diamond MEMS sensors.

Vertiv completes acquisition of MEMS maintenance business

12/06/2018  Vertiv announced today that it has completed the purchase of the maintenance business of MEMS Power Generation (MEMS), a privately-owned company headquartered in the United Kingdom that specializes in temporary power solutions.

Three CEA projects awarded European Research Council Synergy Grants

11/26/2018  The European Research Council (ERC) has just published the list of 27 projects it selected out of the 299 submitted to the ERC Synergy 2018 call for projects.

Altair Semiconductor and JIG-SAW partner on LTE-enabled sensors for industrial IoT

11/21/2018  Altair Semiconductor announced today it has partnered with JIG-SAW Inc. to develop LTE-enabled sensors for a wide variety of global industrial IoT applications.

SUNY Poly professors awarded $330,000 for two distinct cutting-edge nanotechnology-centered research projects

11/20/2018  Dr. Serge Oktyabrsky received $200,000 from the U.S. Department of Energy to develop next-gen scintillation detectors based on quantum dots to enable a better understanding of basic particles.

SEMICON Korea to showcase AI, smart manufacturing, talent

11/20/2018  With Korea expected to remain the world's largest consumer of semiconductor equipment, building on its 18 percent share in 2018, SEMICON Korea 2019 is poised to connect global electronics manufacturing companies to new opportunities.

MEMS and sensors in autonomous and electric vehicles: Key takeaways from IHS Markit at MSEC

11/15/2018  IHS Markit’s Jérémie Bouchaud provided a closer look at and outlook for this key market at the MEMS and Sensors Executive Congress in late October in Napa. Following are key takeaways from his presentation.

Nanotubes may give the world better batteries

10/26/2018  Rice U. scientists' method quenches lithium metal dendrites in batteries that charge faster, last longer.

Highly efficient wet-processed solar cells with molecules in the same orientation

10/26/2018  Researchers at Kanazawa University report in the journal Organic Electronics documents a new method for controlling the orientation of conducting molecules in organic solar cells that results in the enhanced light adsorption and performance of the cells.

Speeding MEMS innovation and production

10/26/2018  SEMI’s Nishita Rao spoke with Ron Polcawich about the MEMS workshop on rapid innovation that he held earlier this year and his interest in continuing that conversation with a broad audience of MEMS and sensors suppliers attending MEMS & Sensors Executive Congress.

Sensera further expands fabrication capabilities with dicing, wafer bonding and electroplating technologies

10/25/2018  c. announced it has acquired and qualified additional thin-film processing equipment including a dicing saw, a wafer bonder and an electroplating cell to meet the growing customer demand in this segment.

Inexpensive chip-based device may transform spectrometry

10/23/2018  Tiny device could replace expensive lab-scale equipment for many applications.

Leti and Taiwanese National Applied Research Laboratories team up to strengthen microelectronics innovation in France and Taiwan

10/23/2018  Two leading French and Taiwanese research institutes today announced their new collaboration to facilitate a scientific and technological exchange between France and Taiwan.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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