11/10/2015  New research suggests wrapping silver nanowires with an ultrathin layer of graphene protects the structures from damage and could represent a key to realizing their commercial potential.

11/03/2015  FEI Company and DCG Systems, Inc. announced an agreement where FEI willacquire DCG for $160 million in an all cash transaction.

11/03/2015  FEI announced the Helios G4 DualBeam series, which offers the highest throughput ultra-thin TEM lamella preparation for leading-edge semiconductor manufacturing and failure analysis applications.

11/02/2015  X-FAB Silicon Foundries announced it will expand the capacity and capabilities of its Kuching-based foundry operation, X-FAB Sarawak Sdn. Bhd., to meet accelerating demand for its core technologies.

10/30/2015  Soraa announced that it will open a new semiconductor fabrication plant in Syracuse, New York.

10/30/2015  Texas Instruments (Maxim Integrated) and STMicro (Fairchild) may be considering large acquisitions.

10/28/2015  InvenSense announced it has released for OEM review UltraPrint, its ultrasonic fingerprint imaging solution, manufactured on the proprietary InvenSense CMOS-MEMS Platform (ICMP).

10/28/2015  Nordson EFD introduces a new series of pneumatic non-contact dispensing systems.

10/27/2015  mCube announced the industry’s first 3-axis accelerometer which is less than a cubic millimeter in total size.

10/27/2015  Brewer Science, Inc., and Arkema announced a partnership to produce high-quality directed self-assembly (DSA) materials for use in semiconductor manufacturing.

10/26/2015  RIKEN scientists have discovered that wrinkles in graphene can restrict the motion of electrons to one dimension, forming a junction-like structure that changes from zero-gap conductor to semiconductor back to zero-gap conductor.

10/21/2015  Western Digital Corporation and SanDisk Corporation today announced that they have entered into a definitive agreement where Western Digital will purchase SanDisk.

09/29/2015  Hillcrest Labs unveiled its MotionEngine (TM) Wear software with always-on, sensor-enabled features optimized for the latest generation of wearable devices.

09/28/2015  ULVAC, Inc. announced that the company has developed G-TRAN series multi ionization gauge ST2, a transducer-type ionization vacuum gauge.

09/16/2015  September 30 - October 2, 2015, Wild Horse Pass Hotel & Casino, Chandler, AZ, USA. ICPT 2015 provides the largest forum for academic researchers, industrial practitioners and engineers from around the world dedicated to the exchange of information on the state-of-the-art in Chemical Mechanical Polishing (CMP) and other planarization technologies.

09/09/2015  Semiconductor equipment manufacturer ClassOne Technology has today announced the appointment of Kevin Witt to the position of Chief Technology Officer.

09/08/2015  The SEMI award recognizes Jason’s significant achievements in the development and commercialization of copper wire in the IC assembly process.

09/04/2015  Nordson Corporation today announced it has acquired Munich, Germany-based MatriX Technologies GmbH, a manufacturer of automated X-ray inspection (AXI) equipment used to ensure the quality of electronic printed circuit boards, critical electronic devices and fully assembled products in consumer, automotive and other industrial end markets worldwide.

09/04/2015  QEOS, Inc., a designer of connectivity and sensing CMOS millimeter-wave (mmWave) solutions, and GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced they are partnering to co-develop the industry’s first mmW CMOS platform.

09/03/2015  In 2014, the automotive sector significantly outperformed the overall market average for semiconductors.