09/02/2015  CyberOptics Corporation, a global developer and manufacturer of high precision 3D sensing technology solutions, will demonstrate the first wireless sensor to combine leveling, vibration and Relative humidity (RH) measurement in an all-in-one device at SEMICON Taiwan in Taipei, September 2-4, 2015.

09/02/2015  SEMICON Taiwan 2015 opened today starting a three-day event drawing over 43,000 attendees from electronics manufacturing.

09/01/2015  SEMI, the global association serving the electronics supply chain, today announced the appointment of Laith Altimime as president of SEMI Europe, effective October 1, 2015.

09/01/2015  At the 65th IEEE ECTC, several companies presented advances in thermos-compression bonding.

08/31/2015  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company is experiencing strong demand for its automated 300mm polymer adhesive wafer bonding systems.

08/18/2015  With trade policy dominating headlines in recent weeks, all eyes were on Maui in the waning days of August as trade ministers from twelve nations convened for perhaps the final time to finalize the Trans-Pacific Partnership (TPP).

08/07/2015  Easily manufactured, low cost, lightweight, flexible dielectric polymers that can operate at high temperatures may be the solution to energy storage and power conversion in electric vehicles and other high temperature applications, according to a team of Penn State engineers.

08/05/2015  STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today the promotion and appointment of Dr. Han Byung Joon as Co-President and Chief Executive Officer for the Company, together with Mr. Tan Lay Koon.

07/27/2015  Within the photolithography equipment market reaching $150M in 2014, advanced packaging applications experienced the strongest growth.

07/22/2015  SEMI today announced the fourth annual European 3D Summit. Entitled ?European 3D Summit 2016: Above and Beyond TSV,? the advanced semiconductor Summit will take place on January 18-20, 2016 in Minatec in Grenoble, France.

07/21/2015  Amkor Technology, Inc. today announced plans to expand its assembly and test factory located in China’s Shanghai Waigaoqiao Free Trade Zone.

07/16/2015  Wafer bumping has several advantages over traditional wire bonding. Bumps can be placed almost anywhere on the die, where wire bonding is limited to the periphery of the devices. And bumps give you the ability to put many more I/O points on an individual die.

07/14/2015  The expansion of fan-out is finally coming, says Rich Rogoff, Vice President and General Manager, Lithography Systems Group at Rudolph Technologies.

07/14/2015  The used and refurbished semiconductor equipment market can be a hazardous business for buyers. The watchword always is: Caveat emptor – let the buyer beware.

07/09/2015  IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using micro- and nanoelectronics, and its partners CEA-Leti, STMicroelectronics and Mentor Graphics have realized an innovative 3D chip called “3DNoC” to demonstrate the use of 3D stacking technology in scalable, complex digital systems-on-chip (SoCs).

05/29/2015  SEMI this week announced the SEMICON West 2015 test and packaging program agendas.

05/29/2015  NXP Semiconductors and Stora Enso have entered into joint development of intelligent packaging solutions.

05/21/2015  Semiconductor test equipment supplier Advantest Corporation announced today that it has developed a technology utilizing short-pulse terahertz waves for analysis of electrical circuits.

05/14/2015  Semiconductor Research Corporation (SRC) announced today that Ken Hansen has been appointed SRC’s new President and Chief Executive Officer (CEO), effective June 1.

05/07/2015  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Micrel, Incorporated today announced that Microchip has signed a definitive agreement to acquire Micrel.