11/04/2014  Kandou Bus has announced the Glasswing family of chip interconnects targeted for in-package chip-to-chip links.

11/04/2014  Rice University scientists who want to gain an edge in energy production and storage report they have found it in molybdenum disulfide.

11/04/2014  At this week’s VISION 2014 exhibition, imec presents a backside-illuminated (BSI) CMOS image sensor chip featuring a new anti-reflective coating (ARC) optimized for UV light.

10/29/2014  SiTime Corporation, a MEMS and analog semiconductor company, today announced that it has signed a definitive agreement under which MegaChips Corporation, a top 25 fabless semiconductor company based in Japan, will acquire SiTime for $200 million in cash.

10/15/2014  Element Six this week announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130.

10/15/2014  IRLYNX and CEA-Leti today announced they have launched a technology-development partnership for a new CMOS-based infrared technology that will allow a new type of smart and connected detectors in buildings and cities.

10/14/2014  Texas Instruments today announced it has shipped more than 22 billion units of copper wire bonding technology from its internal assembly sites and is now in production for major high reliability applications including automotive and industrial.

10/13/2014  A novel metal gate integration scheme to achieve precise threshold voltage (VT) control for multiple VTs is described.

10/02/2014  ARM and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology.

10/01/2014  Boston Semi Equipment LLC (BSE) today announced it has combined all of its automated test equipment (ATE) businesses under the Boston Semi Equipment brand name.

09/18/2014  Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

09/18/2014  Oxford Instruments is hosting its third series of annual seminars for the nanotechnology industry in India in November.

09/09/2014  Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

09/09/2014  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced the “GLOBALFOUNDRIES Undergraduate Research Scholarship,” a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry.

08/27/2014  Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies.

08/14/2014  The global pressure sensors market was valued at $6.53 billion USD in 2013, growing at a CAGR of 6.2% from 2014 to 2020 to account for $9.36 billion USD in 2020.

08/12/2014  University of California, Davis researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, are exploring new materials and device structures to develop next-generation memory technologies.

08/05/2014  NSF's Center for Hierarchical Manufacturing proves good test bed for large-scale nanomanufacturing designs .

08/04/2014  Extremely thin, semi-transparent, flexible solar cells could soon become reality.

07/31/2014  The SEMI Strategic Materials Conference, held September 30–October 1 in Santa Clara, Calif., will examine the drivers for new materials and how they impact material suppliers and the value chain they serve.