01/23/2014  Green is the color for the decade and future decades as each country is developing its own standards for energy consumption and implementing its green initiatives.

01/15/2014  The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its $20 billion value through 2017, despite shifts away from the use of precious metals such as gold in wire bonding.

11/26/2013 

11/25/2013  Dongbu HiTek today announced that it has begun volume production of 5.0 Megapixel (5M) CMOS Image Sensor (CIS) devices for Superpix Micro Technology Co., Ltd., a fabless customer based in Beijing.

11/21/2013  Foundry 2.0 partnership with Open-Silicon and Amkor Technology yields successful 2.5D test vehicle project.

11/18/2013  STMicroelectronics and Yogitech, a provider of functional safety solutions, have signed an agreement to create a comprehensive package that will simplify the development and certification of safety-critical applications based on STM32 microcontrollers.

11/12/2013  FlipChip International announced today the 100% acquisition of Millennium Microtech (Shanghai) - (MMS), a provider of fully integrated semiconductor packaging and testing services situated in the Zhang Jiang Hi- Tech Park, Pudong New Area, Shanghai, China.

11/07/2013  Fabless semiconductor company DecaWave announced today its first single chip of the ScenSor wireless technology family, DW1000, which makes indoor location and communications more accurate, cost-effective and power-efficient than ever before.

11/01/2013  Columbia Engineers develop new device architecture for 2D materials, making electrical contact from the 1D edge.

11/01/2013  SMT equipment market continues to derive demand from major downstream industry segments including telecommunications, computing and consumer appliances, which are the most prolific users of PCBs, according to a new report from Global Industry Analysts, Inc.

10/31/2013  Toshiba Corporation today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology.

10/30/2013  At the recent ECTC conference, various presentations addressed silicon interposers for 2.5D (Shinko), CoWoS reliability (TSMC) and microbumping (imec).

10/23/2013  Carlos Lee, Director General of the European Photonics Industry Consortium (EPIC), moderated a discussion with executives from the UK photonics industry and filed this report.

10/15/2013  Small form factor, high speed and performance, and high bandwidth capability with low battery consumption are desired traits for many packaging solutions for integrated circuits (ICs).

10/15/2013  A research team in Japan has built a triangular InGaAs-on-insulator n-MOSFETs using MOVPE that has a high on-current of 930 µA/µm.

10/14/2013  Recent blogs address semiconductors in healthcare (blood cell sorters), FinFETs and logic roadmaps, 450mm progress, panel level embedded tech, materials innovation, options to reduce mask write time, SOI and EUV.

10/10/2013  SEMI believes that the semiconductor materials market will trend with the device market, resulting in an increase of one percent this year and a seven percent increase in 2014, resulting in a materials market approaching $50 billion in 2014.

10/09/2013  Next-gen SnAg offers industry-leading plating rates and process flexibility for flipchip packages and interconnects

09/26/2013  GE Healthcare Finland Oy, in partnership with GE Idea Works, announced today that it has completed the acquisition of Imbera Electronics Oy.

09/24/2013  Next-generation integrated devices for matching, filtering and protection help shrink circuit size and boost end-product performance.