Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Scientists develop multicolor LEDs without heavy metals

02/25/2013 

Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals and can emit light in various colors.

Painting with catalysts: Nano-engineered materials for detoxifying water

02/22/2013 

Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.

UNL research moving closer to cracking silicon barrier

02/22/2013 

The ability to improve silicon transistors is reaching its fundamental limit, so researchers are searching for new ways to keep making electronic devices faster and more powerful. University of Nebraska-Lincoln physicists and colleagues have taken a major step toward breaking that silicon barrier.

RRAM: Understanding reliability issues

02/21/2013 

Tim Turner, the Reliability Center Business Development Manager at the College of Nanoscale Science and Engineering (CNSE), Albany, NY, blogs about the potential of resistive memory and the reliability challenges the must be overcome.

Leti to coordinate European supply chain in silicon photonics

02/20/2013 

CEA-Leti today announced that it will coordinate a four-year project aimed at building a European-based supply chain in silicon photonics and speeding industrialization of the technology.

Poongsan to partner with SEMATECH

02/20/2013 

Joint effort to explore novel process techniques to improve device performance and reliability in semiconductor manufacturing for sub 20nm technology node.

STMicroelectronics 28nm FD-SOI technology hits 3GHz operating speed

02/20/2013 

STMicroelectronics announced today another milestone in its testing of its 28nm FD-SOI Technology Platform.

Five IC suppliers to hold one-third of 300mm wafer capacity in 2013

02/20/2013 

Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.

Production process doubles speed and efficiency of flexible electronics

02/20/2013 

Stretched-out clothing might not be a great practice for laundry day, but in the case of microprocessor manufacture, stretching out the atomic structure of the silicon in the critical components of a device can be a good way to increase a processor's performance.

300-millimeter thin-wafer products by Infineon now being shipped worldwide

02/19/2013 

In February, Infineon received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at their site in Villach, Austria.

Engineers at University of Buffalo develop hyperbolic metamaterial waveguide

02/14/2013 

By creating a material that slows light, engineers open new possibilities in solar energy, military technology and other fields of research.

Smartphones and tablets drive continued double-digit growth in MEMS motion sensor market

02/14/2013 

Smartphones and media tablets continue to the prime movers of technology industries, with the two mobile platforms spurring a double-digit increase in the market for microelectromechanical system (MEMS) motion sensors this year.

Global market for MEMS microphone to more than double in five years

02/13/2013 

The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.

Solid state thin film batteries market worth $6 Billion by 2019

02/12/2013 

Markets for solid state thin-film batteries at $65.9 million in 2012 are anticipated to reach $5.95 billion by 2019, according to a new report released by ReportsnReports.com.

ISSCC 2013: Imagers, MEMS, medical and displays

02/11/2013 

Roland Thomas, subcommittee chair of ISSCC, writes of the substantial growth and future in key areas of technology.

ISSCC 2013: Large-area flexible electronics

02/11/2013 

Hoi-Jun Yoo, subcommittee chair of ISSCC 2013, writes on the focus of technology directions in the field of large-area and low-temperature electronics.

SEMI China releases Top Ten list of packaging and assembling facilities

02/07/2013 

Although many are small companies manufacturing low-pin count devices, all of the world’s “Top 10” OSAT, Outsourced Semiconductor Assembly and Test, players have one or more assembly and testing facilities in China.

Econometric Forecast: Regional developments to affect growth of semiconductor industry

02/07/2013 

In the first of two installments, we examine the global issues facing the semiconductor industry, as released by Linx Consulting in The Econometric Semiconductor Forecast.

Econometric forecasting service predicts 6% growth in semiconductor wafers in 2013

02/07/2013 

A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting.

Dow Corning and IBM scientists develop new materials for board-level photonics

02/05/2013 

Dow Corning and IBM scientists unveiled a major step in photonics yesterday at the Photonics West conference, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts