08/24/2012 

iNEMI is starting a new convergence project on semiconductor packaging equipment requirements, and is seeking input from the industry.

08/20/2012 

Assembl

08/16/2012 

Hesse & Knipps Inc. will demo a new 3mil wire bonding capability on its BJ935 automatic heavy wire bonder for back-end semiconductor packaging at IMAPS in San Diego.

08/15/2012 

Kulicke & Soffa Industries, Inc. (K&S, NASDAQ:KLIC) appointed Irene Lee to the role of chief quality officer. Lee will oversee quality assurance functions across Kulicke & Soffa

08/14/2012 

Monolithic Power Systems (MPS) implemented yieldWerx Semiconductor Test and Yield Management tools. MPS required a robust and centralized system for effective storage, analysis, and sharing of testing and product data received from multiple foundries, assembly, and testing facilities in the US and Asia.

08/10/2012 

Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.

08/09/2012 

Researchers at National Cheng Kung University (NCKU) in southern Taiwan developed a tin/zinc/silver/aluminum/gallium solder alloy for semiconductor packaging, which was tested by ASE.

08/08/2012 

Multitest, semiconductor test equipment supplier, added a 2D code reader option to its MT2168 pick-and-place test handler, for package test customers that require 100% device traceability and lot integrity.

08/08/2012 

Henkel Electronic Materials developed a new underfill system designed to reduce flip chip package stress by controlling die and substrate warpage, LOCTITE ECCOBOND UF 8840.

08/07/2012 

Agilent debuted its compliance test application, Agilent N6462A DDR4, for systems using DDR4 memory.

08/03/2012 

Zuken updated its CR-5000 design software to version 14, with greater collaboration in FPGA development and targeting high-speed design. Many enhancements have also been included in CR-5000 Lightning, Zuken

08/02/2012 

The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.

08/01/2012 

Park Electrochemical plans to cease operations at its Nelco Technology (Zhuhai FTZ) Ltd. facility in Zhuhai, China. Nelco products include microwave and RF component substrates, printed circuit materials, and advanced substrates such as BT.

07/31/2012 

Mesuro, semiconductor testing and services provider, raised

07/31/2012 

LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.

07/31/2012 

Cascade Microtech introduced the modular MPS150 manual wafer probe station with six application-specific test packages for RF, mmW, and I-V/C-V measurement; failure analysis; and high-power device characterization.

07/30/2012 

Henkel Electronic Materials added LOCTITE ABLESTIK CDF 200P to its conductive die attach film offering. The pre-cut film is available in 150mm and 200mm diameter sizes for easy wafer-form matching. The film is both a dicing tape and die attach tape.

07/30/2012 

CGI Americas is introducing the QMO Series inert gas and vacuum ovens and MOL Series Class 100 cleanroom ovens, based on the SMO Series precision ovens from C Sun, to the North American market.

07/27/2012 

Cascade Microtech Inc. (NASDAQ:CSCD), supplier of wafer-level measurement instruments for ICs, held its first Innovation Awards Ceremony to honor inventors, authors and other innovators at the company.

07/26/2012 

ASM Pacific Technology Limited noted in its H1 2012 results a record level of orders for leadframes in Q2. It also delivered what it calls the largest leadframe packaging set up to date.