05/16/2012 

The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copper-wire bonding, and automatic rethreading.

05/16/2012 

Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company

05/15/2012 

05/14/2012 

Heraeus introduced its high-reliability composite aluminum/copper (CucorAl) semiconductor bonding wire, which offers strong mechanical and electrical bonds to semiconductor pads, with good thermal properties.

05/14/2012 

Asia-based ASM Pacific Technology (ASMPT) Group, a supplier of semiconductor assembly, bonding, and packaging equipment, will integrate with the SIPLACE organization in Europe.

05/07/2012 

Sales of semiconductor probe cards grew 17% in 2011, reaching $1.17 billion, VLSIresearch reports. While short of a record, 2011 was one of the probe card sector

05/07/2012 

A leading, US-based IDM ordered about $5 million of front- and back-end semiconductor automatic optical inspection (AOI) tools from Camtek Ltd.

05/03/2012 

Solid State Technology is proud to announce that David McCann will speak at The ConFab 2012. David, the Senior Director for Packaging R&D at GLOBALFOUNDRIES in Malta, New York, will speak on the evolution toward silicon-based interconnect and packaging, which is having profound impact on how we think about technology development and the supply chain.

05/03/2012 

Nitto Denko Corporation approved a transfer of its semiconductor encapsulating materials business to Hitachi Chemical Co. Ltd.

05/03/2012 

Multitest introduced the ecoAmp Kelvin contactor for high-power device test of 500+ Amperes. It meets the needs of high voltage/high current test with high thermal and mechanical stability.

05/01/2012 

The top three outsourced semiconductor assembly and test services (OSATS) providers raised 2012 capex during their earnings reports, from initial plans announced in January, report analysts at Citi.

04/25/2012 

Nordson ASYMTEK uncrated the NexJet System for jetting, with a newly designed jet cartridge and new software control for semiconductor packaging applications.

04/23/2012 

Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.

04/23/2012 

Aeroflex will supply manufacturing test technology for radio frequency (RF) devices at Qualcomm customers, under a new licensing agreement with Qualcomm.

04/19/2012 

Ultratech, lithography and laser-processing system supplier to semiconductor manufacturers and packaging providers, added Michael C. Child to its Board of Directors. Child served on Ultratech

04/19/2012 

Texas Instruments awarded 15 of its 12,000 suppliers with Supplier Excellence Awards for delivering outstanding service and support, based on cost, environmental responsibility, technology responsiveness, assurance of supply, and quality.

04/16/2012 

Micro Control Company uncrated the HPB-5C High-Power Burn-In System, with variable airflow control for active thermal control of each device under test. The HPB-5C provides individual temperature control to each device under test.

04/16/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: electronic skin, energy storage with nanowires, printable inks, gas sensing, inkjet printing, semiconductor polymers for organic devices, CNTs, OFETs, touch screen fabrics, and the coffee breaks.

04/13/2012 

04/13/2012 

Intel Corporation announced 9 winners of the company's Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance excellence.