04/12/2012 

DARPA gave Raytheon an 18-month, $1.8 million contract to develop next-generation GaN devices on diamond substrates, named Thermally Enhanced Gallium Nitride (TEGaN). The diamond packaging boosts GaN power handling capability by at least 3x.

04/12/2012 

DELO introduced DELOMONOPOX die attach adhesives, promising strong mechanical/environmental protection, low-temperature cure, and compatibility with various substrates.

04/12/2012 

Intel Corporation announced its 2011 Intel Preferred Quality Supplier (PQS) awards, selecting 19 of its thousands of suppliers. Two suppliers received Intel’s Achievement Award.

04/11/2012 

Agilent launched Express Test for ultra-fast, high-precision nanomechanical testing on thin films, low-k materials, composites, and more. It allows 100 indents on 100 surface sites in 100 seconds.

04/10/2012 

The 2012 Symposia on VLSI Technology and Circuits, this June in Honolulu, HI, will foster joint interactions among device technologists and circuit/system designers with overlapping technical programs of both symposia, and joint focus sessions on important topics.

04/10/2012 

CEA-Leti and passive component maker IPDiA developed an atomic layer deposition (ALD) process to apply medium-k dielectric layers on a metal-insulator-metal capacitor architecture, enabling 3D capacitors.

04/10/2012 

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at the growth areas for test.

04/09/2012 

Rogers Corporation (NYSE: ROG) shared an update on its restructuring and streamlining initiatives, which are expected to save about $13 million (annualized savings) by Q4.

04/04/2012 

Henkel

04/04/2012 

Mereco Technologies' METADUCT 1202 is an electrically conductive silver epoxy adhesive for lead attachment cold soldering, chip bonding, and leadframe bonding applications.

04/03/2012 

Ferro Electronic Materials expanded its LTCC portfolio, adding a line of cost-effective matched materials. The L8 LTCC system claims better performance over a greater range of frequencies and easier manufacturability.

04/03/2012 

The global semiconductor materials -- wafer fabrication and packaging materials -- market increased 7% in 2011 compared to 2010, with record revenues of $47.86 billion, said SEMI.

04/02/2012 

Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.

04/02/2012 

Bruker Corporation acquired all of the shares of SkyScan NV, a scientific instruments company serving materials science and life sciences/pre-clinical imaging needs.

03/30/2012 

Yamaichi developed a test adapter with the European Design Centre, suitable for test and programming of embedded modules such as Qseven or MXM.

03/30/2012 

SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.

03/29/2012 

Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.

03/27/2012 

03/27/2012 

RED Micro Wire (RWM), a subsidiary of RED Equipment, announced a new high-quality copper wire featuring glass insulation for use in semiconductor wire bonding.

03/26/2012 

Applied Materials will host its annual Analyst meeting this week (March 28). Barclays Capital shares its expectations for AMAT's update and the wafer fab equipment (WFE) outlook in general.