Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES


Micro glass drilling enables 0.1mm semiconductor interposers

03/08/2012 

AGC (Asahi Glass Co. Ltd.) developed ultra-high-speed processing technology for micro hole drilling of 0.1mm-thin glass, targeting leading-edge applications such as 3D semiconductor packages.
SMIC releases Cu-BEOL manufacturing platform library

03/08/2012 

Surrey NanoSystems commercializing advanced packaging innovations with $7M new funding

03/07/2012 

Surrey NanoSystems raised third-round funding of

Henkel underfill boasts high Tg for WLCSP and PoP devices

03/06/2012 

Henkel developed LOCTITE UF3810 underfill for high reliability and ease of rework when applied to next-generation wafer-level chipscale packages (WLCSP) and package-on-package (PoP) devices.
Package and micro-mechanical test equipment installed at DfR Solutions

03/06/2012 

DfR Solutions installed micro testing tools from XYZTEC for JEDEC qualification, dynamic bend testing, copper wire bond pull and shear testing, and material characterization of lead-free solders.
Multitest test contactor suits large-array, high-pin-count digital chip test

03/02/2012 

Multitest launched a new Quad Tech contactor, the Triton contactor, for high-end digital test applications such as server, computer, mobile smartphone, digital TV, and graphics chips.
HB-LED grade aluminum nitride (AlN) sintering

03/02/2012 

Part 2 of this series covers furnace considerations for a new HB-LED-grade AlN, as well as furnace throughput. Jonathan Harris, CMC Laboratories, covers the role of the oxide sintering phase in AlN in defining the materials microstructure and thus determining key properties such as thermal conductivity and mechanical strength.
Elpida begins reorganization in Tokyo court: Analysts weigh in

03/02/2012 

Elpida Memory Inc. (Tokyo: 6665) resolved to file a petition for the commencement of corporate reorganization proceedings, and filed the same with the Tokyo District Court. Akita Elpida Memory Inc. also saw the commencement of corporate reorganization proceedings
WACKER opens silicone R&D center for Korean electronics makers

03/02/2012 

WACKER expanded and relocated its South Korea technical laboratories and offices, bringing together R&D operations, applications technology, and basic and advanced training in silicones and polymers applications.
Thermal modeling software aids 3D IC, SoC, SiP designs

03/01/2012 

Docea Power, power and thermal analysis software supplier, released AceThermalModeler for generating compact thermal models of SoCs, 3D ICs, SiP devices, and complete boards.
DuPont sells CMP JV interests to Air Products

03/01/2012 

Air Products will acquire all of DuPont's interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), a 50-50 JV that the companies set up for the semiconductor and wafer polishing industries.
Package and test provider orders new Verigy Smart Scale technology

03/01/2012 

HB-LED grade aluminum nitride meets thermal needs of today's LEDs

02/24/2012 

In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.
LED packaging report reveals costs, reliability impact of package

02/24/2012 

With thermal issues accounting for half of all lighting failures, and costs prohibitive to widespread adoption, assembly and packaging are keys to improving LEDs. TechSearch International tracks LED packaging materials and methods, as well as reliability and package efficiency.
NEXX Systems bolsters employee skills with new grant

02/23/2012 

Chip substrate factory begins producing thermal-control substrates in Russia

02/22/2012 

MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.
Present at ESTC 2012 in Amsterdam

02/21/2012 

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.
Join iNEMI's electronics manufacturing supply chain workshop at IPC APEX

02/17/2012 

iNEMI will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2.
Shin-Etsu Chemical releases low-RI LED encapsulants

02/17/2012 

Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower gas permeability and higher transparency.
Universities: Enter to win a Finetech die bonder

02/15/2012 

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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