10/18/2011 

MVTS Technologies opened new offices in San Jose, CA; Penang, Malaysia; and Hsinchu, Taiwan to support growing demand for test, assembly, and other IC production equipment and services among semiconductor manufacturers.

10/17/2011 

ERS uncrated the ERS AirCool 3 wafer thermal test system with modular options and easy integration into all major wafer prober systems.

10/14/2011 

At the IMAPS 44th International Symposium on Microelectronics in Long Beach, CA, Voya Markovich, well-known industry PCB and packaging expert, took over the reins as the organization

10/14/2011 

Steven J. Adamson, marketing specialist with Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and the microelectronics packaging industry.

10/13/2011 

SEMI honored Dr. Tibor Pavelka (Semilab) with the European SEMI Award; Heinz Kundert (SEMI Europe) with the IC Industry Award for Excellence; and Christian Prischmann (UIbrich) with the SEMI Europe Standards Leadership Award.

10/11/2011 

EV Group (EVG) will work with Fraunhofer IZM's ASSID research center to develop temporary bonding/debonding technologies for thicker die structures, some as large as 600

10/11/2011 

Cascade Microtech Inc. debuted InfinityQuad, a multi-contact probe head capable of automatically probing aluminum (Al), copper (cu), or gold (Au) pads as small as 30 x 50

10/11/2011 

All Silicon System Integration Dresden (ASSID) installed an Altatech 300mm CVD tool for dielectric film deposition on advanced through silicon vias (TSV), with diameters as small as 10

10/07/2011 

DuPont Microcircuit Materials, part of DuPont Electronics & Communications, uncrated its DuPont GreenTape 9K5 low temperature co-fired ceramic (LTCC) packaging material, offering good dielectric constant properties for higher speed, frequency, and reliability applications.

10/06/2011 

Test equipment provider Multitest installed a MT9928 XM Gravity Test Handler at a semiconductor production facility after a 1-year+ benchmarking against two major competitors.

10/04/2011 

Tamar Technology shipped its first fully automated WaferScan system to a major semiconductor fab. The system performs TSV etch depth, deep trench depth, wafer thickness, photo-resist thickness, and hole diameter metrology.

10/03/2011 

Boston College researchers have discovered two early-stage phases of carbon nanotube (CNT) growth during plasma enhanced chemical vapor deposition (PECVD). A disorderly tangle of tube growth ultimately turns into orderly rows of the nanoscopic tubes.

10/03/2011 

IMAPS 2011, the 44th International Symposium on Microelectronics, will take place in less than one week at the Long Beach Convention Center. Ahead of the show, here are some of the highlights for attendees.

09/30/2011 

Semiconductor equipment spending in 2011 looks to be slightly weaker than anticipated, and is looking a lot softer in 2012 across the board, according to Gartner's new semiconductor capex forecasts.

09/28/2011 

Both graphene and carbon nanotubes (CNT) suit applications from flexible displays to silicon-replacing transistors. In a relatively short time, graphene has emerged as a low-cost, tunable material for all kinds of electronics. Will graphene overtake CNTs as the nanomaterial of future devices?

09/27/2011 

Seiko Epson Corporation introduced the IP-2000 inkjet semiconductor marking system to print identification data on the surface of a semiconductor package without the danger of damage from laser cutting

09/27/2011 

Cascade Microtech (NASDAQ:CSCD) completed the sale of its test socket manufacturing business for $550,000 to R&D Interconnect Solutions. Cascade's board of directors also authorized a stock repurchase program under which up to $2,000,000 of its common stock may be repurchased.

09/27/2011 

In a podcast interview with ElectroIQ.com, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the Ziptronix wafer bonding technology and their partnership with Sony.

09/22/2011 

An Environmental Protection Agency (EPA) consent order now permits SWeNT to manufacture and distribute multi-wall carbon nanotubes (MWCNT) for commercial applications.

09/22/2011 

Rogers Corporation's (NYSE:ROG) Board of Directors elected Bruce D. Hoechner as the materials company's new president and CEO, effective October 3, 2011. Hoechner's past positions were with Rohm and Haas and Dow Chemical.