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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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A little zinc can do a lot of damage to graphene. Rice University researchers have taken advantage of that to create single-atomic-layer lithography. The Rice lab of chemist James Tour sputtered zinc onto multilayered graphene, enabling the team to remove a single layer at a time without disturbing the layers beneath.
A solid composite heat-conducting material created by scientists at the Georgia Tech Research Institute has a thermal conductivity that is higher than any metal and takes advantage of the properties of diamond. The silver-diamond composite is being aimed at cooling wide-bandgap semiconductors planned for next-generation phased-array radars.
The new gold/tin (AuSn) process from Stellar Industries is ideally matched to Stellar’s proprietary CPU copper on AlN submounts with its sharp guillotine edge for precise edge alignments.
Epoxy materials are being transformed into stiffer, lighter, and stronger materials thanks to fullerenes and carbon nanotubes (CNTs). Dongsheng Mao, Applied Nanotech, describes a process involving multi-walled carbon nanotubes that have stronger mechanical properties yet remain lightweight and within end-product cost parameters.
Multitest received its fifth full purchase order for its InCarrier device transfer system with InStrip test handling system adapted to metal frame-based carriers.
Custom fabricated sapphire wafer carriers that are uniform, parallel, and impervious to solvents and etchants for thinning semiconductor materials are available from Meller Optics Inc.
As gold becomes more expensive, copper wire bonding becomes more appealing for chip packaging. Reverse bonding, fine-pitch bonding, looping, second bonds, and other technologies are ramping on roadmaps, according to Kulicke & Soffa (K&S).
Horacio Mendez, executive director of the SOI Industry Consortium, discusses how planar FD-SOI technology enables substantial improvements in performance and power consumption. The SOI Industry Consortium recently announced results of an assessment and characterization of FDSOI, based on the ARM Cortex processor as a prototyping vehicle.