02/14/2011 

Dolomite, microfluidic designer and manufacturer, expanded its range of temperature control systems with the Hotplate Adaptor - Chip Holder H, which allows control over internal temperatures of microfluidic chips without any disruptions to the fluid flow.

02/13/2011 

Hitachi Chemical has granted Henkel a worldwide license for the manufacture and sales of certain dicing die attach film.

02/11/2011 

Palomar Technologies, precision microelectronics and optoelectronic packaging systems provider, will hold meetings at Stategies in Light to discuss its recent upgrades to high-brightness LED (HB-LED) assembly.

02/10/2011 

Research teams from Japan and Finland have developed a simple and rapid technique to fab carbon nanotube (CNT) thin film transistors on plastic film. The methodology could be extended to R2R manufacturing to enable complex ICs for flexible electronics.

02/09/2011 

Nanocarbon -- carbon nanotubes, fullerenes, graphene, etc. -- production reached less than 25% of capacity in 2010, according to a new report from iRAP Inc. Capacity utilization is expected to reach 50% in 2015. Prices for these products will drop annually by more than 10%.

02/09/2011 

After beta testing and product analysis, CyberOptics Semiconductor has released the WaferSense Airborne Particle Sensor for wafer processing equipment. The sensor identifies particle sources in tools, moving through semiconductor process equipment and automation material handing systems to monitor airborne particles. It reports information in real-time on wafer contamination.

02/08/2011 

Scientists at the University of Gothenburg successfully defended a thesis on the subject of carbon nanotube fundamentals, "In Silco Studies of Carbon Nanotubes and Metal Clusters." CNTs can be regarded as thin threads of pure carbon, whose length can be a billion times greater than their thickness.

02/08/2011 

Students are invited to compete for fellowships to implement graphene-related research at CEA in Grenoble beginning in January 2012. Teams participating in the Graphene Fundamentals and Applications Session will receive project mentoring from leading global experts, including a Nobel Prize recipient.

02/03/2011 

Arizona State University's Hongbin Yu and Hao Yan are exploring how to use top-down lithography combined with modified bottom-up self-assembling nanostructures to guide the placement of nanostructures on silicon wafers.

02/02/2011 

Rice University researchers are studying the amount of strength needed to pull a multiwall carbon nanotube (MWCNT) from a bead of epoxy. A spring-loaded, push-pull micromechanical assembly on a silicon chip allows researchers to string a MWCNT to a blanket of epoxy on one side while the other is held firmly in place with a platinum anchor.

02/02/2011 

Rice University researchers are studying the amount of strength needed to pull a multiwall carbon nanotube (MWCNT) from a bead of epoxy. A spring-loaded, push-pull micromechanical assembly on a silicon chip allows researchers to string a MWCNT to a blanket of epoxy on one side while the other is held firmly in place with a platinum anchor.

02/02/2011 

All the major semiconductor players are embracing 3D integration, says Simon Deleonibus. The CEA-Leti scientist and IEEE Fellow wants to see TSV mature and new technologies develop based on wafer bonding. He speaks with Debra Vogler.

02/01/2011 

Creative Materials Inc. announced a new series of pressure-sensitive tapes that suit use in the fabrication of solar cells and modules; to replace solder and/or conductive adhesive connections; or as bus bar materials for a wide variety of printed electronics applications, including touch panels, LCDs, electro-chromatic displays, and electro-luminescent displays.

01/31/2011 

Arthur Chait, president and CEO of EoPlex, describes the company’s high-volume print forming technology -- a lead carrier product called xLC-- and how it enables a cost-effective replacement for conventional quad flat pack no-lead (QFN) leadframes.

01/27/2011 

A fast-cure, low-shrinkage adhesive for optics and optical assembly, DYMAX OP-67-LS opto-mechanical adhesive cures in seconds for bonding of optical components. The product's low-shrink nature virtually eliminates movement during curing and subsequent thermal cycling.

01/26/2011 

Steed Technology, thermal processing equipment provider for semiconductor, LED, and solar cell manufacturers, acquired all of the outstanding stock of Applied Technology Specialists, Inc. (ATSI), an advanced engineering firm that specializes in developing advanced pollution control equipment and technology. The merger will enable equipment integration and additional "green" consulting expertise at Steed.

01/24/2011 

UT Dallas nanotechnologists have invented a groundbreaking new technology for producing weavable, knittable, sewable and knottable yarns containing giant amounts of otherwise unspinnable powders. The reseaerchers see applications for the technology in energy storage, energy conversion and energy harvesting.

01/24/2011 

Appropriate for this blustery ski season, the clear view of semiconductor equipment demand appears to be heading down a slope, according to data from semiconductor manufacturing equipment makers.

01/24/2011 

SRC and researchers from Stanford University have developed a combination of elements that yields a unique nanostructure material for packaging. This advance should allow longer life for semiconductor devices while costing less than current state-of-the-art materials.

01/20/2011 

The imec multi-partner industrial R&D program on GaN semiconductor materials and device technologies focuses next-generation GaN power device and LED development. The collaboration between Dow Corning and imec will concentrate on bringing the GaN epi-technology on silicon wafers to a manufacturing scale.