12/11/2010 

AT&S debuted a new technology to enable system-in-package (SiP) devices. AT&S’s embedded component packaging technology ECP is used to enable further miniaturiztion of electronic devices while enhancing their performance.

12/10/2010 

Fujitsu Labs says it has developed a hybrid device that harvests energy and generates electricity from either heat or light, resulting in an economical device with potential use in sensor networks and medical technologies.

12/08/2010 

Joachim Burghartz, IMS CHIPS, presented an improved version of the group's Chipfilm technology introduced at IEDM 4 years ago. The researchers now have a manufacturable process technology.

12/07/2010 

SEMI International is forming a standards committee to evaluate and create specifications and practices for 3D stacked ICs (3DS-IC), with initial efforts targeting three areas: bonded wafers, inspection/metrology, and thin wafer handling.

12/07/2010 

As 2010 shapes up as a record year for semiconductor equipment spending, so the following two years will be a slow fall back to Earth with low single-digit overall growth, according to SEMI's updated forecasts -- though there are some interesting trends within the numbers.

12/06/2010 

A team of researchers at the University of Maryland is working to harness and exploiting the "self-renewing" and "self-assembling" properties of viruses for a higher purpose: to build a new generation of small, powerful and highly efficient batteries and fuel cells.

12/06/2010 

Bruker Corp. announced the release of a new generation of Atomic Force Microscopy (AFM) modes and measurement modules that transform Bruker's AFM systems into turnkey solutions for nanoscale characterization in renewable energy research.

12/06/2010 

Eleven semiconductor equipment manufacturers earned VLSI Research's five-star rating this year, earning top marks in various metrics adding up to "exceptional customer satisfaction."

12/03/2010 

Bruce Weisman and his lab found that adding tiny amounts of ozone to batches of single-walled carbon nanotubes (SWCNT) and exposing them to light decorates all the CNTs with oxygen atoms and systematically changes their near-infrared fluorescence.

12/03/2010 

VectorGuard 3D stencils are designed for specialist applications requiring multiple level printing. Facilitating printing on different levels with upward or downward steps, VectorGuard 3D enables a uniform stencil thickness.

12/02/2010 

SAFC Hitech announced plans to build a new, dedicated facility in Kaohsiung, Taiwan for transfilling, technical service and production of chemical precursors used for high brightness LED and silicon semiconductor manufacturing.

12/01/2010 

The recent difficulties in semiconductor sales and the unusually rapidly declining IC price/performance index are slowing semiconductor equipment demand. Essentially, 2010 has been a 2-for-1 deal for both chips and equipment with two years of growth in one year, resulting in overcapacity and declining chip prices, says VLSI.

11/26/2010 

Five factors drove TSMC's decision to select the gate-last approach: speed, power, reliability, manufacturability, and scalability. Di Ma, VP, field technical support at TSMC, speaks with ElectroIQ about TSMC’s efforts with respect to transistor architecture beyond HK+MG.

11/24/2010 

Tokyo Electron Limited and Tanaka Kikinzoku Kogyo K.K. have developed a sucessful recycling process for ruthenium precursors (CVD-ruthenium material) used in next-generation semiconductor miniaturization technology.

11/23/2010 

Jae-Woong Nah, researcher at IBM's Thomas J. Watson Research Center, briefed ElectroIQ on his IMAPS conference paper: "Mask and mask-less injection molded solder (IMS) technology for fine-pitch substrate bumping." IMS is a variation of C4NP for solder deposition on fine-pitch laminates. Nah explains how the researchers injected 100% pure molten solder instead of solder paste with a reusable film mask for forming high-volume solder on fine-pitch substrates.

11/22/2010 

NovaCentrix announced that Metalon ICI-020, a new copper-based screen ink, will be featured at Printed Electronics USA 2010 in Santa Clara, CA, November 30-December 2, 2010. Pre-printed samples of Metalon ICI-020 screen ink on card stock will be distributed with the registration packs by IDTechEx staff, and attendees may bring their samples to the NovaCentrix exhibit area to cure the ink with NovaCentrix’s PulseForge process tool.

11/19/2010 

Good news: September numbers for semiconductor equipment demand were a little bit better than originally thought. Bad news: October numbers are worse, and it's even more clear that we're on the downslope of a summertime demand peak.

11/19/2010 

Magnolia Solar Corporation welcomed Zhong Lin Wang, Distinguished Professor and Director, Center for Nanostructure Characterization at Georgia Tech, to its Technical Advisory Board. Professor Wang is an expert in nanostructure growth and characterization of semiconductor materials and devices for energy harvesting technology.

11/19/2010 

Optically active semiconductor nanopillar arrays now absorb sunlight better than ever, thanks to research carried out at Lawrence Berkeley National Laboratory and the University of California at Berkeley.

11/18/2010 

David Hwang from Lux Research analyzes the impact of six different nanotechnologies on efforts to improve energy efficiency.