Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



3D processing at Tohoku U

02/20/2017  At the recent IEEE 3DIC Conference, Koyanagi and co-workers at Tohoku Univ reported on their studies of Ti as a 3D TSV barrier layer.

Invensas announces Teledyne DALSA sign DBI technology transfer and license agreement

02/17/2017  Wafer bonding and 3D interconnect technology to enable delivery of next-generation MEMS and image sensor solutions.

3D and 2.5D IC packaging market expected to be worth $170B by 2022

02/14/2017  The market is expected to be worth USD 170.46 billion in 2022, at a CAGR of 38.30% between 2016 and 2022.

IC market growth limited by narrow window of global GDP expansion

02/09/2017  Significant and noticeable IC market growth closely tied to significant worldwide GDP growth.

Nexperia emerges as dynamic new force in discretes, logic and MOSFETs

02/07/2017  Former Standard Products Division of NXP combines experience, product and operational excellence with customer focus and ambition.

Micron CEO announces upcoming retirement

02/02/2017  Micron Technology, Inc. today announced the upcoming retirement of its Chief Executive Officer, Mark Durcan.

Samsung and Apple continued to lead as top global semiconductor customers in 2016

02/01/2017  Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2016, representing 18.2 percent of the total worldwide market, according to Gartner, Inc.

Top 3 trends impacting the global field-programmable gate array market through 2021

01/27/2017  Technavio’s latest market research report on the global field-programmable gate array (FPGA) market provides an analysis of the most important trends expected to impact the market outlook from 2017-2021.

Do not go where the path may lead

01/27/2017  What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.

Global semiconductor chip packaging market dominated by 3DIC through-silicon via stacks packaging technique

01/26/2017  The global semiconductor chip packaging market is expected to grow at a CAGR of more than 31% during the forecast period.

Executive viewpoints: 2017 outlook

01/25/2017  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

Amtech announces large orders for high throughput PECVD systems and bi-facial n-type technology

01/24/2017  Amtech Systems, Inc. today announced fiscal year 2017 year-to-date order bookings through January 20, 2017 are approximately $84 million.

Fire, rain, and M&A 

01/19/2017  The expert panel, "The Future of M&A in the Semiconductor Industry," was a hot topic at SEMI's Industry Strategy Symposium (ISS) conference on January 11.

Dow Corning expands LED packaging design options with launch of new silicone coatings

01/17/2017  Dow Corning significantly expanded the design flexibilities for LED packaging manufacturers today with the addition of three new highly reflective silicone coatings to its fast-growing portfolio of advanced LED solutions.

$24B semiconductor assembly and testing services market poised for steady growth

01/13/2017  This week, Future Market Insights (FMI) releases its latest report on the semiconductor assembly and testing services market.

Versum Materials reaches milestone with installation of 200th CHEMGUARD Gen. III refill system

01/06/2017  The Delivery Systems and Services Group (DS&S) of Versum Materials, Inc. (NYSE: VSM) has realized an important milestone: the sale and commissioning of its 200th CHEMGUARD Gen III high purity, liquid delivery system since the product line launched in early 2016.

A year in review: Top 10 stories of 2016

12/23/2016  From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

62 new facilities start operation 2017 and beyond

12/19/2016  Data from SEMI’s recently updated World Fab Forecast report reveal that 62 new Front End facilities will begin operation between 2017 and 2020.

North American semiconductor equipment industry posts November 2016 book-to-bill ratio of 0.96

12/16/2016  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

Global Semiconductor Alliance announces 2016 Award recipients

12/09/2016  The Global Semiconductor Alliance (GSA) is proud to announce the award recipients honored at the 2016 GSA Awards Dinner Celebration that took place in Santa Clara, California.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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