07/27/2010 

Stanford University placed an order for two Plasma-Therm deposition systems: a VERSALINE HDPCVD system and a Shuttlelock PECVD system. The tools will be installed at Stanford’s Nanofabrication Facility.

07/26/2010 

Henkel’s Hysol FP5201 NCP offers the underfill protection required for Cu Pillar technology, effectively mitigating the stress between the substrate and the die.

07/23/2010 

A new paper from the lab of Rice University chemist James Tour demonstrates an environmentally friendly way to make bulk quantities of graphene oxide (GO), an insulating version of single-atom-thick graphene expected to find use in all kinds of material and electronic applications.

07/23/2010 

Shin-Etsu Silicones of America Inc., U.S. subsidiary of Shin-Etsu Chemical Co. Ltd., Japan, launched the TC-CA Series, comprised of Shin-Etsu’s advanced polymer and thermally conductive filler composite material technologies. The low-hardness silicone soft pad series of products have both high thermal conductivity and excellent electrical insulation properties.

07/22/2010 

SEMI's June numbers for semiconductor equipment demand hit a milestone, officially surpassing pre-meltown levels, but numbers are somewhat mixed -- and the future's as blurry as ever.

07/21/2010 

Multitest designed differential contactors that are customized for each semiconductor test application. The selection of the contactor materials and probes are optimized for the desired impedance.

07/21/2010 

IME, a research institute of A*STAR, announced a collaborative partnership with Stanford University to develop silicon-nanowire-based circuits that are inspired by the brain. Under the research collaborative agreement, IME and Stanford will jointly develop silicon-nanowire-based neuromorphic computational elements (silicon neurons) that take advantage of the capabilities of nanowire technology.

07/20/2010 

Nextreme Thermal Solutions will now include materials evaluation and characterization services in its consulting portfolio. With recent advances in materials sciences and nanotechnology, new materials are being developed that exhibit thermoelectric properties.

07/19/2010 

A confluence of new piezo-based technology has added new capability into the nano- and micro-positioning world. The global market for piezoelectric-operated actuators and motors was estimated to be $6.6 billion in 2009 and is estimated to reach $12.3 billion by 2014, showing an AAGR of 13.2%/year.

07/16/2010 

SEMICON West 2010 wrapped this week in San Francisco. This article includes JC Kim, SEMI Board of Directors Chair, discussing the show and the semiconductor industry future. We also have POVs from the show floor by the ElectroIQ.com bloggers.

07/15/2010 

In this video from SEMICON West 2010, Marcus Wimplinger, EV Group, summarizes the results of SEMATECH work using EVG's 300mm bonding systems that enables submicron alignment. Highly accruate wafer bonding is used for Cu-to-Cu bonding and other packaging applications.

07/14/2010 

Rice University scientists have found the ultimate solvent for all kinds of carbon nanotubes (CNTs), a breakthrough that brings the creation of a highly conductive quantum nanowire closer.

07/13/2010 

 Innovation drives everything -- and innovation spawned from the semiconductor and related industries is poised to do nothing less than change the world, or at least help everyone adapt better to it, as related by SEMICON West kickoff keynoter Bernie Meyerson of IBM.

07/13/2010 

Unit shipments of key semiconductor materials are already back to record levels just a year after the most punishing period in the industry's history, but the growth will slow in 2011 for several reasons, according to the latest forecast data presented at SEMICON West.

07/09/2010 

Metallic carbon nanotubes (CNT) show great promise for applications from microelectronics to power lines because of their ballistic transmission of electrons. But who knew magnets could stop those electrons in their tracks?

07/07/2010 

Multitest expanded the portfolio of its Singapore spare parts distribution center for pogo pin-based test contactors. With this step, all major spare parts for semiconductor package test handlers and contactors are now available for fast delivery to Asian package test sites.

07/06/2010 

Surrey NanoSystems launched an automated, versatile growth platform, NanoGrowth-Catalyst. Incorporating nine advanced nanomaterial processing techniques, the platform can synthesize a variety of nanomaterials including graphene, nanowires, and carbon nanotubes.

07/02/2010 

Interplex NAS, supplier of precision components and assemblies and a division of Interplex Industries, Inc., added to its line of solder and flux-bearing lead products. The new surface mount pin, a short-current path lead, offers advantages in the circuit assembly process.

07/01/2010 

A new German nanotechnology company has started its business: Particular GmbH has commercialized a novel process for the production of highly pure nanoparticles.

07/01/2010 

Electronics experts developing technology for aerospace and defense applications confront few issues as daunting as the heat generated from their designs. Engineers are under constant pressure to develop ever-smaller and more powerful electronics, yet the cost of doing so creates ever-larger amounts of heat, and ever-larger electronics thermal management problems.