12/08/2016  The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

12/07/2016  “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.

12/07/2016  Two years of busy M&A activity boost marketshare among top suppliers.

11/16/2016  TriLumina Corp., a developer of semiconductor laser illuminators for solid-state LiDAR systems that enable autonomous vehicles and new automotive safety systems, announced that Brian Wong has been named as the company's new President and Chief Executive Officer and as a member of the board of directors.

11/11/2016  According to the latest market study released by Technavio, the global fan-in wafer-level packaging (WLP) market is expected to reach USD 4.75 billion by 2020, growing at a CAGR of almost 10%.

11/02/2016  In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole in its report Status and Prospects for the Advanced Packaging Industry.

10/30/2016  Toshiba was the first to commercially implement CMOS image sensors with backside TSV last technologies in 2007. Many of us stated in 2007 that further advances could be obtained by removing the CMOS circuitry to a separate layer and forming a true 3D chip stack, but the technology imple- mentation had to wait while the industry first converted to back side imaging technology.

10/24/2016  180nm CMOS and HV-CMOS MPW runs are now manufactured in ams' 200mm fabrication facility in Austria.

10/17/2016  A new type of atomic force microscope (AFM) uses nanowires as tiny sensors. Unlike standard AFM, the device with a nanowire sensor enables measurements of both the size and direction of forces. Physicists at the University of Basel and at the EPF Lausanne have described these results in the recent issue of Nature Nanotechnology.

10/07/2016  Scientists have created a material that could make reading biological signals, from heartbeats to brainwaves, much more sensitive.

10/06/2016  The parties decided to it was not in the best interests of their respective stakeholders to continue pursuing the merger after the U.S. Department of Justice advised KLA-Tencor and Lam Research that it would not continue with a consent decree that the parties had been negotiating.

10/05/2016  Today, SEMI announced an exceptional lineup of keynotes at SEMICON Japan's "SuperTHEATER" focusing on innovation and insights into the future of the electronics supply chain.

10/03/2016  Silicon Labs today announced the acquisition of Micrium, a supplier of real-time operating system (RTOS) software for the Internet of Things (IoT).

09/28/2016  Synopsys, Inc. today announced that TSMC is recognizing Synopsys with three "2016 Partner of the Year" awards for Interface IP and joint development of 7-nanometer (nm) mobile and HPC design platforms.

09/22/2016  Synopsys, Inc. today announced a collaboration with TSMC to complete the certification for its 16-nanometer (nm) FinFET Compact (16FFC) process for a suite of Synopsys' digital, custom and signoff tools from the Galaxy Design Platform.

09/21/2016  At the 2016 ECTC Conference, TSMC discussed their UFI (UBM-Free Integration) Fan-In WLCSP technology which they claim enables large die fine pitch packages.

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

09/20/2016  Toshiba America Electronic Components, Inc. has expanded its family of 24nm single-level cell (SLC) NAND flash memory solutions.

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

09/16/2016  Nordson Corporation today announced it plans to combine its existing screw and barrel operations in Youngstown, Ohio; New Castle, Pennsylvania; and Pulaski, Virginia into a single expanded manufacturing center of excellence in Austintown, Ohio.