07/15/2008  FEI Co. is debuting a new line of SEM tools designed to give researchers a sharper picture of sub-nanometer surface detail than with a SEM. It also is rebundling its technologies to smooth a SEM-to-STEM transition .

07/10/2008  July 10, 2008 -- Researchers at Hitachi Cambridge Laboratory (Cambridge, England) and the Nano-Science Center, Niels Bohr Institute, University of Copenhagen have created a so-called "double quantum dot" by placing two 50 nm titanium electrodes on the carbon nanotube to act as source and drain, along with three central top-gate electrodes of aluminum oxide and titanium.

07/09/2008  July 9, 2008 -- Arrowhead Research Corporation has formed Agonn Systems Corporation to explore, develop and commercialize nanotechnology-based energy storage devices for electric vehicles and other large format applications.

07/03/2008  July 3, 2008 - The overall market for electronic design automation (EDA) declined 1.2% in 1Q08 to about $1.35B from a year ago but was up 5.9% sequentially, and the IC physical design/verification sector showed mix results, according to data from the EDA Consortium.

07/02/2008  The BONDJET BJ820, from Hesse & Knipps, is a high-speed, fully automatic wedge bonder for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform - including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive - using aluminum or gold wire or ribbon. It reportedly offers bond speeds up to 7 wires-per-second.

07/01/2008  To promote electronics material advancement in the burgeoning China region, Henkel and Shanghai University, in conjunction with several leading research universities, entered into an agreement to form a Shanghai Region Joint Electronics Research and Failure Analysis Center. The official signing ceremony marking the commencement of the partnership took place on June 10, 2008 at Henkel Asia-Pacific and China headquarters in Shanghai, China.

07/01/2008  In one of the most beautiful areas imaginable in the Pacific Northwest amidst flowers and greenery, two companies do leading-edge research and development work that affects how electronics work.

06/27/2008  June 27, 2008 -- The Chair of Display Technology, Universitaet Stuttgart and Nano-Proprietary, Inc.'s subsidiary Applied Nanotech, Inc. (ANI) have achieved significant advancement in the application of carbon nanotubes for the flexible electronics industry

06/26/2008  LORD Corporation, supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics industry, will embark on a $2.5 million renovation to its electronic materials labs in Cary, N.C. The expansion is intended to allow the company to add capabilities for technology development, such as individual package device reliability testing, said John Hill, technology manager for LORD's electronic boards and components industry group.

06/26/2008  June 26, 2008 -- Cambridge NanoTech, a supplier of Atomic Layer Deposition (ALD) systems for research and industry, announced the shipment of its 100th ALD System to the Tata Institute of Fundamental Research (TIFR) in Mumbai, India.

06/25/2008  June 25, 2008 -- U.Va. School of Engineering and Applied Science and Virginia Tech's Department of Chemistry have teamed up to offer a long distance cross-university team teaching course.

06/24/2008  June 24, 2008 -- Gaining momentum from recent orders and installations, sp3 Diamond Technologies, Inc. (sp3), a supplier of diamond film products, equipment and services, has received two new orders for its Model 650 hot filament chemical vapor deposition (HFCVD) diamond reactor

06/23/2008  June 23, 2008 -- FEI Company, a provider of high-resolution imaging and analysis systems, has released the Titan 80-300 environmental transmission electron microscope (ETEM), a solution for chemical research at the atomic scale.

06/21/2008  June 20, 2008 - Chip equipment firm Ferrotec is one of many companies seeking to diversify into new growth opportunities, and its move into solar cells seems to have met with applause from investors and market players, notes the Nikkei daily.

06/20/2008  June 20, 2008 - Offering more evidence for chipmakers' belt-tightening this year, semiconductor equipment demand has slumped to three-year lows, to levels not seen since mid-2005, according to the latest monthly data from SEMI.

06/20/2008  June 20, 2008 -- Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, joined with researchers at Stanford University to achieve CMOS-compatible working circuits on a wafer scale.

06/19/2008  Advanced Knowledge Associates (AKA), a manufacturer of miniaturized and reconfigurable system-on-module solutions, has joined the Small Form Factor special interest group (SFF-SIG), a new, non-profit industry group that develops, promotes, and supports small form factor circuit board specifications and related technologies.

06/17/2008  June 17, 2008 - Worldwide demand for semiconductor manufacturing was notably soft in 1Q08, with bookings down >20% from a year ago, but some regions are clearly working through the downturn better than others, according to the latest data from SEMI.

06/17/2008  MT-431, from Lord Corporation, is a non-silicone thermal die lid attach (TDLA) adhesive that was reportedly developed to replace two material processes, with a single effective solution. The material is formulated with thermal and adhesion properties that perform well enough to replace both typical thermal interface materials (TIMS) and lid attach adhesive.

06/17/2008  June 17, 2008 -- Carbon Nanoprobes (CN Probes), a start-up focused on commercializing advanced nano imaging technology, has selected First Nano's applications laboratory to complete one of the most critical stages of development before the launch of CN Probes flagship product, a carbon nanotube probe tip, for use in Atomic Force Microscopes (AFM).