09/01/2016  SEMI announced today that the deadline for presenters to submit an abstract for the annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is October 17.

08/29/2016  According to the latest market study released by Technavio, the global front-end-of-the-line semiconductor equipment market recorded a revenue of over $22 billion in 2015 and this growth is expected to exceed $24 billion in 2020.

08/26/2016  Edwards Vacuum has been recognized as one of ten companies receiving a 2016 Supplier Excellence Award from Lam Research Corp.

08/24/2016  A leading South Korean research university has successfully integrated two Advanced Vacuum plasma processing systems from Plasma-Therm into its nanotechnology fabrication lab, which supports multiple users engaged in wide-ranging nanotechnology research.

08/17/2016  SEMI announced today that over 43,000 visitors are expected to attend SEMICON Taiwan September 7-9 at the TWTC Nangang Exhibition Hall in Taipei.

08/16/2016  Reno Sub-Systems today announced that it has secured its first platform design win for its Electronically Variable Capacitor (EVC) matching network.

07/28/2016  Busch, LLC this week announced plans to build a new 44,000 sq. ft. building in Austin, Texas.

07/25/2016  Applied Materials, Inc. today announced the appointment of Judy Bruner to serve on its Board of Directors. Ms. Bruner has also been appointed to serve as a member of the Audit Committee of the Board.

07/22/2016  Worldwide semiconductor capital spending is projected to decline 0.7 percent in 2016, to $64.3 billion, according to Gartner, Inc. This is up from the estimated 2 percent decline in Gartner's previous quarterly forecast.

07/19/2016  The semiconductor industry is moving quickly to adopt a variety of new materials in an effort to increase chip performance.

07/15/2016  At the ECTC conference in May, in the “Advances in Fan Out Packaging” session, Matt Lueck of RTI International discussed the results of their joint program with X-Celeprint.

07/13/2016  Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.

07/11/2016  Clearfind technology sees organic defects that often escape detection with conventional white-light inspection technologies.

07/11/2016  Applied Materials, Inc. today announced its next-generation e-beam inspection system is delivering the highest resolution and image quality at the fastest throughput to leading foundry, logic, DRAM and 3D NAND customers as they move to advanced nodes.

07/08/2016  Weak global economy and poor DRAM market to drag down growth this year.

07/06/2016  EV Group (EVG) today introduced new capabilities on the EVG ComBond automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices

06/28/2016  A Clarkson University research team reports surprising findings that could have significant impact for constructing nano-patterned materials in electronic, magnetic or optical devices.

06/23/2016  For fan-out wafer-level packaging and 3D packaging, thin wafer handling is critical; the wafer must not warp, bend or shift during any wafer-processing steps.

06/22/2016  Emerging opportunities for advanced packaging solutions for heterogeneous integration include a lot more than logic, memory and sensors.

06/21/2016  Amkor Technology Inc., a provider of semiconductor packaging and test services, today announced it has received the Supplier of the Year award from Qualcomm Technologies, Inc.