Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



KIC Celebrates Its 30th Year in the Electronics Industry

02/04/2008  ; KIC, a manufacturer of thermal process development and control products, announces that it is entering its 30th year of business within the electronics industry. Founded in 1977 by Casey Kazmierowicz, KIC entered the electronics industry with the introduction of the first continuous monitoring system for conveyorized furnaces for microcomputers.

Motorola to Explore Structural and Strategic Realignment

02/01/2008  ; Motorola Inc. has announced it is exploring the structural and strategic realignment of its businesses to better equip its Mobile Devices business. The company's alternatives may include the separation of Mobile Devices from its other businesses in order to permit each business to grow and better serve its customers.

FDA requests nearly $2.4B for fiscal 2009

02/01/2008  The U.S. Food and Drug Administration (FDA) is requesting nearly $2.4 billion “to protect and promote public health” as part of the President’s fiscal year 2009 (FY09) budget.

Litron announces cleanroom for hermetic sealing

01/31/2008  January 28, 2008 -- /AGAWAM, MA/

Nextreme's new thermoelectric platform targets optoelectronics

01/24/2008  Nextreme Thermal Solutions developed its new Ultra-High Packing Fraction (UPF) OptoCooler to improve the performance of electronics without sacrificing efficiency.

ZESTRON Asia/Pacific Relocates to Larger Facility

01/24/2008  ; ZESTRON Asia/Pacific has announced its recent relocation to a much larger facility in Shanghai, China. Located in the Zun Xuan Industrial Park, ZESTRON's new facility is reportedly home to the largest Asia/Pacific Application Technology Center.

Fujifilm materials biz buys ArF immersion tool to monitor photoresists

01/21/2008  Jan. 21, 2008 - Fujifilm says its electronics materials subsidiary has purchased an advanced argon fluoride (ArF) immersion scanner to help accelerate the push to bring its new family of ArF immersion photoresists to high-volume manufacturing.

IMEC, U.Albany combining EUV efforts

01/21/2008  Jan. 21, 2008 - The two leading R&D centers for EUV lithography, IMEC in Europe and the U. of Albany's College of Nanoscale Science and Engineering (CSNE), say they will jointly perform experiments for EUV in order to "demonstrate the practical feasibility of EUVL and build confidence in the technology for the 32nm half-pitch device node and below."

SEMI: North American chip tool firms get Xmas present

01/18/2008  Jan. 18, 2007 - December results for semiconductor equipment demand show a nice close to what was otherwise a lousy 2007 -- actual positive growth in tool orders, according to the latest data from SEMI.

Multitest's 1000th Test Handler Installed in Malaysia

01/18/2008  ; Multitest's Malaysia office has announced that the company's 1000th test handler was installed in Malaysia late last month. Multitest has a total worldwide installed base of over 4000 test handlers, however. Malaysia is the first territory to achieve this number of 1000 installed multitest test handlers.

MEPTEC Announces Keynote for Thermal Management Symposium

01/18/2008  ; MEPTEC, the MicroElectronics Packaging and Test Engineering Council, is pleased to announce the addition of Joseph Fjelstad, President, Verdant Electronics as keynote speaker for its 4th Annual Thermal Management symposium titled "The Heat Is On: Thermal Technology Solutions for Advanced Products." this one-day technical event will be held on February 28 at the Wyndham Hotel, San Jose.

nCoat partners with CAMSS for nano-based coatings

01/16/2008  nCoat Inc. has established a partnership with North Carolina Agricultural and Technical State University in Greensboro, N.C., for characterization and development of nanotechnology based materials and industrial coatings.

AMAT laying off 7% of workers -- who saw it coming?

01/15/2008  Jan. 15, 2008 - Applied Materials says it is reducing its global workforce by about 7% (1000 workers) through a combination of job elimination and attrition, primarily affecting its semiconductor equipment and services/support businesses.

MIT gas sensor is tiny, quick and energy efficient

01/13/2008  Engineers at MIT are developing a tiny sensor that could be used to detect minute quantities of hazardous gases, including toxic industrial chemicals and chemical warfare agents, much more quickly than current devices.

Nanophase issued new surface treatment patent

01/10/2008  Nanophase Technologies' new patent for a novel surface treatment promises to overcome problems with the use of nanoparticles in product formulations.

Cutting back: Nanometrics laying off 7%

01/10/2008  Jan. 10, 2008 - Coming off a year in which it significantly changed its focus and carved out multiple businesses, Nanometrics is starting the new year where it left off.

Carbon Nanoprobes closes equity financing

01/10/2008  Carbon Nanoprobes Inc., a company specializing in devices that serve the nanotechnology and biotechnology industries, has closed an A-round of investment capital and has hired more managers.

Phase Change Materials in a Liquid Product

01/07/2008  The PowerstrateXtreme Dispensable (PSX-D) phase change material in liquid form offers many of the usability and throughput advantages of thermal greases without the drawbacks inherent with some thermal grease applications. As a paste medium, Henkel's PSX-D alleviates the challenges associated with phase change films and the shortcomings of thermal greases by incorporating phase change performance into a liquid product.

SEMI B:B inches up, but demand still soft

01/02/2008  Jan. 2, 2008 - Global demand for semiconductor equipment made by North American-based manufacturers didn't improve much in November, according to recent data from SEMI.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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