Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Report: TSMC, Hon Hai partnering in LEDs

11/06/2007  November 6, 2007 - TSMC and Hon Hai Group are reportedly teaming up in the LED industry, via a business deal involving two partners.

Varian's wind project gets local nod

11/06/2007  November 6, 2007 - After nearly three years of work and lobbying, Varian Semiconductor Equipment Associates Inc. says it has received approval from the Gloucester (MA) City Council to build two wind turbines, in a bid to dent one of its larger operating costs: the electric bill.

People in Packaging

11/05/2007  Nanocomp Technologies Inc., developer of next-generation performance materials, announced the appointment of John H. Dorr as vice president of business development to guide the management, marketing, and strategic planning for the commercialization of the company's carbon nanotube-based products. Earlier this year, Nanocomp unveiled its multi-functional nonwoven sheets and yarns from long, pure, single-wall carbon nanotubes.

Näf guides first nanotech risk management certification

11/01/2007  Hans Näf joined a low-key celebration typical of the Swiss to commemorate completion of one of the world’s first certified risk-management systems for nanotechnology companies.

Nano grows in the Netherlands’ Food Valley

11/01/2007  As the Netherlands nurtures its food and nanotechnology pursuits to produce what may be the world’s leading locale for advancing food-related development, it finds a unique support structure

Analyst: Chip tool market to rise modestly after 3Q trough

10/25/2007  October 25, 2007 - After touching a trough in 3Q07, semiconductor equipment sales should head back up with small positive growth over the next several quarters, according to market analysis firm The Information Network.

TI's Stork jumps ship, lands at AMAT

10/25/2007  October 25, 2007 - Hans Stork, formerly CTO and SVP of silicon technology development at Texas Instruments, has left his position to take on the role of CTO and group VP of Applied Materials' silicon systems group, responsible for the company's development of semiconductor equipment technologies.

Cientifica: Nanodelivery can bring new life to pharma IP

10/22/2007  Cientifica, a London-based nanotech research firm, says nanotech-enabled improvements to existing pharmaceuticals have created a "new value paradigm" in the drug delivery market.

SEMI: Tool demand slowing down significantly

10/19/2007  October 19, 2007 - The latest monthly figures are in for semiconductor equipment demand, and the data is ugly just about any way you slice it. Bookings are -25% since a peak in May, with Y-Y % declines at a two-year low -- and the M-M drop in billings is the worst in nearly five years.

Nano-C awarded $2.9 million for nanomaterial development

10/19/2007  Nano-C Inc., developer of nanostructured carbon materials, will receive about $2.9 million over three years from the National Institute of Standards and Technology (NIST), the company announced.

September Book-to-bill Slips to .81

10/19/2007  ; The September book-to-bill ratio for North American-based manufacturers of semiconductor equipment slipped another notch from August, from .82 to .81, reports SEMI.

Photovoltaic metallization paste materials, system

10/18/2007  A new series of screen printable thick film materials from DuPont Microcircuit Materials, Bristol, UK, enables solar cell manufacturers to reduce their cost per watt by reportedly achieving higher cell efficiencies, higher production yields, and lower material consumption.

New DuPont nanomaterial tests Nano Risk Framework

10/17/2007  Cooperation between chemical company and environmental activists helped guide development of a new plastic-protection coating that contains titanium dioxide nanoparticles.

IBM creates method for measuring CNT performance

10/16/2007  October 16, 2007 - A team of scientists at IBM's T.J. Watson Research Center say they have used Raman spectroscopy to measured the electron density in <2nm-dia. carbon nanotubes (CNT) by examining the interactions between electrons and phonons. The work will help better gauge how the CNTs release heat and impede electrical flow, thus measuring their suitability for use in future semiconductors.

IBM invents new way to measure performance of nanotubes in computer chips

10/16/2007  A new performance test developed by IBM involves observing the interaction of vibration and light. The technique has helped researchers better measure the suitability of carbon nanotubes as wires and semiconductors.

IMEC, GaTech seeking help for 32nm packaging interconnect work

10/16/2007  October 15, 2007 - IMEC and Georgia Tech's Microsystems Packaging Research Center (PRC) say they want more help to research next-generation flip-chip and substrates to address "IC-to-package-to-board" packaging interconnect issues for ICs at the 32nm node and beyond.

SOLAR NEWS: Taiwan, Japan firms placing solar bets

10/09/2007  October 9, 2007 - A scan of recent headlines nets several stories of interest to the solar/photovoltaics sector, including growth plans by Japanese firms and Taiwan automation tool suppliers, and a US firm's expansion efforts through M&A in Europe.

BASF joins IMEC partners for 32nm IC cleaning

10/08/2007  October 8, 2007 - BASF says it has joined IMEC's Industrial Affiliation Program to research and develop IC cleaning solutions and advanced interconnects, with an eye toward commercialization for the 32nm in 2010.

Aixtron eyes CNT play through Nanoinstruments buy

10/08/2007  October 8, 2007 - Germany's Aixtron AG has agreed to acquire UK-based startup Nanoinstruments, a manufacturer of chemical vapor deposition (CVD) and plasma enhanced CVD research systems for nanomaterials including carbon nanotubes, to extend its portfolio "in the mid- and long term within the nanotechnology application space."

AmberWave, UCSB working on mesoporous materials

10/05/2007  October 5, 2007 - AmberWave Systems and the U. of California/Santa Barbara (UCSB) have agreed to collaborate on and fund materials science research targeting mesoporous materials, in a move to open non-semiconductor business doors for the company.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts