Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



High-tensile TIM

08/13/2007  Targeting long-term use and reworkable assemblies, the Keratherm 86/82 high-tensile-strength thermal interface material (TIM) is thermally conductive and electrically isolating, comprising silicone film with a fiberglass layer.

Green Materials for Flex Circuits

08/13/2007  A halogen-free, RoHS-compliant transparent epoxy polyimide laminate product line, R/flex JADE A targets flexible circuit needs in portable electronics, computing, packages, and other applications.

Hynix picks ISi's ZRAM for DRAMs

08/13/2007  August 13, 2007 - Hynix Semiconductor Inc. will use Innovative Silicon Inc.'s (ISi) ZRAM high-density memory IP for its ZRAM chips, the first company to license the technology for DRAMs (AMD is using it for microprocessors).

FEI's Nova NanoSEM 30 promises superior clarity, versatility

08/08/2007  FEI Company's latest and most powerful scanning electron microscope series, Nova NanoSEM 30, promises "unprecedented capabilities" for nanotechnology characterization and prototyping.

NCS licenses Unidym's carbon nanotubes for cardiovascular disease treatment

08/08/2007  Arrowhead Research Corp.'s majority-owned subsidiary, Unidym Inc., has signed an exclusive license agreement with Paragon's majority-owned subsidiary, Nanotech Catheter Solutions, LLC (NCS). NCS will use Unidym's carbon nanotube technology in the development of medical devices for the treatment of cardiovascular disease.

Ecology Coatings completes reverse merger with OCIS Corporation

08/06/2007  July 30, 2007 -- /PRNewswire/ -- BLOOMFIELD HILLS, MI -- Ecology Coatings, Inc. today announced that it completed its reverse merger with OCIS Corporation on July 26, 2007.

Nanometrics tabs Imago's Stultz to reverse integration "challenges"

08/06/2007  August 6, 2007 - Nanometrics Inc. has appointed Timothy Stultz, former president/CEO of Imago Scientific Instruments, as its new CEO, taking over for Bruce Rhine who held the spot since March and move to the position of chairman, in a culmination of moves in what the company admits has been a year of "challenges."

Oncor deters copper wire theft with nanotechnology

08/03/2007  Oncor Electric Delivery, a business that provides power to more than three million homes and businesses in Texas, says it will implement nanotechnology this summer that will both discourage would-be criminals from stealing copper from the company's substations and switchyards and help law enforcement personnel find and prosecute thieves.

CogniTek, BASF to develop high-efficiency heat exchange

08/02/2007  BASF and CogniTek believe that the unique properties of supercritical carbon dioxide and ionic liquids could transform low-temperature heat (e.g., solar) into high-value power. And so the two will partner to examine the prospect. The result would be an efficient power-generation system with integral heating and cooling.

Cnano scores $6 million to develop low-cost carbon nanotube production

08/02/2007  Cnano Technology Ltd. has received $6 million in venture funding co-led by CMEA Ventures and Pangaea Ventures that included WI Harper. Cnano is focused on manufacturing carbon nanotubes and the development of applications associated with the nanotubes.

AlSiC Heat Spreader for SiP

07/31/2007  RoHS compliant, aluminum silicon carbide (AlSiC) metal-matrix composite lids target system-in-package (SiP) applications. The heat spreaders are said to reduce bowing and flexing with a low coefficient of thermal expansion (CTE) between die and packaging.

Heated Chuck

07/31/2007  The HPR-90 heated work holder suits photoresist, epoxy resin, and adhesives annealing; manual wire bonding; device heating; and other packaging processes. It offers a 90-mm heated area and 360° rotation. The heated area can be changed without moving the equipment.

Thermal Material

07/31/2007  Burn-in material, a reusable thermal interface material (TIM), provides repeatable thermal performance over thousands of cycles, and offers an alternative to greases, phase change materials (PCMs), and gap pads in thermal module test applications.

Nano-Proprietary, Mitsui extend relationship for carbon nanotube lighting

07/31/2007  Nano-Proprietary and Mitsui extend relationship for carbon nanotube lighting

NEWS FROM JAPAN: Firms find ways to better profits in slow environment

07/30/2007  July 30, 2007 - A roundup of the past week's headlines from Japan center largely on April-June financial results, with Toshiba and NEC improving their profits (though largely due to restructuring and asset sales), while Fujitsu takes a hit for finance missteps.

Quantum effect found in silicon nanocrystals

07/27/2007  July 27, 2007 -- Researchers at the U.S. Department of Energy's National Renewable Energy Laboratory (NREL), collaborating with Innovalight, Inc., say they have shown that a new and important effect called Multiple Exciton Generation (MEG) occurs efficiently in silicon nanocrystals. MEG results in the formation of more than one electron per absorbed photon.

Keithley partners with CEA Leti for nanotech and materials research

07/27/2007  Keithley partners with CEA Leti for nanotech and materials research

SUSS Device Bonders Bought Out

07/27/2007  SUSS MicroTec France's president, Gaël Schmidt, used a management buy out (MBO) agreement to acquire SUSS MicroTec's device bonder division. He will rename the company Smart Equipment Technology (S.E.T.); S.E.T. will operate as a simplified joint stock company with about €40,000 ($55,000) capital.

Book-to-Bill Falls in June

07/26/2007  The North American semiconductor equipment manufacturing book-to-bill ratio fell to 0.94 in June 2007, which the indicator hasn't approached since an October 2006 ratio of 0.95. The dip belies the fact that booking and billing amounts are trending up slightly, and hitting highs for the year, said Stanley T. Myers, president and CEO, SEMI.

SEC lawsuits target former Brooks, KLA-Tencor execs

07/26/2007  July 26, 2007 - The US Securities and Exchange Commission has come down hard on former top execs of two semiconductor equipment suppliers for their participation in the wide-ranging practice of stock options backdating in recent years.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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