Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Precision and accuracy key when discussing nano

07/01/2007  The American Association of Cancer Research’s recent article, “Nanoparticles Can Damage DNA, Increase Cancer Risk,” provides a good example of how researchers can unintentionally damage the public’s ability to develop a balanced understanding of nanotechnology.

Unidym brings nanotech to market

07/01/2007  Through its merger with Carbon Nanotechnologies Inc. (CNI), founded by the late Richard Smalley, who won a Nobel prize for his work in nanotechnology, Unidym has assembled a full intellectual property portfolio and a range of patents covering many aspects of carbon nanotubes (CNTs).

Cool applications for hot technologies

07/01/2007  Increasing microelectronic density and processing speeds imply more heat.

NASA nanosensor test successful in orbit

06/29/2007  NASA nanosensor test successful in orbit

Tiger Optics continues expansion of worldwide distribution network

06/27/2007  June 12, 2007 -- Warrington, PA -- Tiger Optics, LLC, a manufacturer of laser-based trace gas analyzers, today announced that it has expanded its worldwide presence by forging new distributor partnerships in Europe and South Africa.

Demand for TMC's ultra-quiet surfaces leads to further expansion

06/26/2007  June 5, 2007 -- PEABODY, MA -- Continued customer demand for Technical Manufacturing Corporation's (TMC) precision floor vibration isolation systems has fueled the company's fourth building expansion in the last 15 years.

BASF, IBM to make 32nm IC materials

06/25/2007  June 25, 2007 - BASF and IBM have signed a joint development agreement for electronic materials to be used in 32nm IC manufacturing by 2010, leveraging IBM's semiconductor process development and BASF's expertise in chemicals and nanotechnology.

FEI launches "world's smallest commercially available" SEM

06/25/2007  Following FEI's earlier unveiling of Phenom-Ed for education, the company has now officially launched the commercial version of its SEM that measures about the size of a tower PC and provides magnification 20 times greater than advanced optical microscopes. Yet its pricing is competitive with high-end optical systems.

MFIC opens Microfluidics Technology Center

06/25/2007  MFIC Corp. has announced the opening of the Microfluidics Technology Center, a state-of-the-art research and discovery facility located at MFIC headquarters in Newton, Mass. MFIC is known for fluid formulation processing equipment to produce small, uniform liquid and solid particles for the biotech, pharmaceutical, chemical, personal care, and food industries.

nCoat to acquire MCCI/JET-HOT

06/21/2007  nCoat has agreed to acquire all capital stock of Metallic Ceramic Coatings Inc. (MCCI), doing business under the brand JET-HOT Coatings. nCoat plans to integrate nano-formulated coatings into the JET-HOT product mix; the combined businesses should achieve two times nCoat's current revenue.

Book-to-Bill Steady in May

06/20/2007  North America-based semiconductor equipment manufacturers posted $1.67 billion in bookings and billings in May, based on a three-month average, bringing the book-to-bill to 1.00 for the month, according to SEMI's report. Values in both segments are up from May of 2006 and from April 2007.

Database Targets MEMS Manufacturability

06/19/2007  ASM International released its MEMS Materials Database: Packaging Module, a licensed database containing mechanical, physical, processing, and component data for materials selection in MEMS packaging. The database targets improvements to time-to-market, reliability, and design and manufacturing of MEMS devices.

MEMS/Nano Software Suite

06/18/2007  Targeting the MEMS and nanotechnology industries, the IntelliSuite v8.2 software tool for MEMS/nano-device development includes nanostructure design tools to enable carbon nanotube (CNT) and nano-structure use in computing, display, medical, sensor, and related devices.

Dense CNTs Viable 3D Interconnects

06/14/2007  As part of research designed to manufacture carbon nanotubes (CNTs) as viable replacements for copper in 3D die-stacking applications, researchers at Rensselaer Polytechnic Institute have implemented a method for compacting CNTs into bundles, enabling better thermal and electrical conductivity. Densification occurs post-growth, allowing scientists to use a known, conventional CNT growth process. CNT density was increased 5–25× in the experiments.

Mentor buys place-and-route firm Sierra Design

06/11/2007  June 11, 2007 - Mentor Graphics has acquired Sierra Design Automation for $90 million in a half-and-half cash/stock deal, bolstering its design offerings. Mentor says the deal will be "slightly accretive" for FY07 (ending Jan.31 2008), and shave about $0.02 off of its anticipated FY08 earnings.

Stanford, U-Cal algorithm helps design more reliable CNT circuits

06/08/2007  Engineers from Stanford and the U. of Southern California have devised a method to design circuits containing carbon nanotubes (CNTs) that should work even when many of the nanotubes are twisted and misaligned.

Analyst: Intel pushing out more chip orders

06/08/2007  June 8, 2007 - Intel Corp. appears to be pushing out all orders and shipments for equipment relating to the upgrade of its fab in New Mexico from 200mm to 300mm-compatible, just three months after announcing it would make that facility into its fourth 45nm production site, according to an analyst report.

New InvenSense gyroscope improves position accuracy

06/07/2007  InvenSense, Inc. has released what it calls "the world's smallest and lowest cost dual-axis gyroscope"-- which also enables dead reckoning for GPS portable navigation devices.

Untangling CNT Interconnect Issues

06/05/2007  Since carbon nanotubes (CNTs) tend to grow with erratic kinks and bends in the tube structure, a group of engineers from Stanford University has devised circuit-simulation algorithms that eliminate bad connections caused by errant CNTs. The work, which involves fine grids rather that direct interconnects, is being presented at the Design Automation Conference (DAC), June 4–8 in San Diego.

GenISys, JEOL, and Cornell partner on nano-EPC

06/05/2007  Microfabrication software provider GenISys GmbH, has formed a technology development partnership with microscope developer JEOL, Ltd., and Cornell University's Nanoscale Science and Technology Facility to develop solutions for direct write e-beam data preparation and electron process correction (nano-EPC) technologies for nano-scale structures.




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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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