03/27/2007  March 27, 2007 - Rohm and Haas Electronic Materials has agreed to license technology from Harvard University's Office of Technology Development for manufacturing and marketing new metal amidinate compounds used in atomic-layer deposition (ALD) of thin films of metal and metal compounds for 45nm and below semiconductor processes.

03/26/2007  Arrowhead Research has formed a new subsidiary and agreed to acquire the assets and name of C Sixty, Inc. (C-60), a company pioneering the development of drugs based on buckministerfullerenes. "The future of medicine lies in targeted delivery of therapeutics through nanotechnology," says Arrowhead's chairman. The acquisition forms Arrowhead's third nanomedicine subsidiary.

03/23/2007  Designed for manufacturability and flexibility in various regional climatic conditions, the Multicore LF600 lead-free solder paste from the electronics group of Henkel provides humidity resistance, 24-hour open times, and low voiding.

03/22/2007  Nanotube manufacturer Carbon Nanotechnologies Inc. (CNI), co-founded by late Nobel Laureate and nanotube pioneer Richard Smalley, has announced plans to merge with nanotube patent aggregator and product developer Unidym. The move gives Unidym control of 59 U.S. issued carbon nanotube-related patents.

03/21/2007  March 21, 2007 - Nearly one year to the day after acquiring overlay metrology firm Soluris Inc., metrology equipment supplier Nanometrics Inc. says it is closing the firm's Concord, MA facility and consolidating all of its overlay metrology production at a facility in Asia.

03/21/2007  March 21, 2007 - Kenici Sekiya, former president/CEO/chairman of DISCO Corp., and Arthur Zafiropoulo, chairman/CEO of Ultratech Inc., have been appointed emeritus members of the SEMI board of directors, in recognition of their service to SEMI and the semiconductor industry.

03/19/2007  March 19, 2007 - SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $40.47 billion in 2006, compared to $32.88 billion in 2005, representing a year-over-year increase of 23 percent.

03/16/2007  THERM-A-GAP 569 and 579 thermal gap-filler materials offer high conformability in pre-formed thicknesses of 0.02

03/16/2007  March 16, 2007 - Bede X-ray Metrology has announced that SEMATECH will use a Bede x-ray metrology system to evaluate novel semiconductor materials needed for the 45nm and 32nm technology nodes and beyond.

03/16/2007  March 16, 2007 - North American-based manufacturers of semiconductor equipment posted $1.65 billion in orders in February 2007 (three-month average basis) and a book-to-bill ratio of 1.05 according to SEMI. The bookings figure is about one percent under the final January 2007 level of $1.67 billion and about 28 percent above the $1.29 billion in orders posted in February 2006.

03/15/2007  March 15, 2007 - According to research reported by the Georgia Institute of Technology, the 3D shells of tiny ocean creatures known as diatoms could provide the foundation for novel electronic devices.

03/15/2007  Cientifica reveals six nanotechnologies for reducing carbon emissions

03/14/2007  March 14, 2007 - Packaging equipment developer NEXX Systems has entered into an ongoing joint development program (JDP) with Taiwan Semiconductor Manufacturing Company Ltd. (TSMC). The JDP represents a collaborative effort to assess, develop, optimize, manufacture, and/or market electrodeposition processes using NEXX's Stratus system, including through silicon vias (TSV), wafer-level chip-scale packaging, and redistribution layers.

03/13/2007  Nanoident has opened "the world's first dedicated manufacturing facility for printed organic semiconductors" in Linz, Austria. In conjunction with the plant opening, the company has also launched its Semiconductor 2.0 platform for a wide array of application-specific printed semiconductor products."

03/13/2007  A new thermal field emission analytical SEM from JEOL promises high-resolution micrographs at up to 1,000,000X for applications ranging from semiconductor, metals, minerals, materials, and ceramics, to non-conductive biological samples.

03/12/2007  March 12, 2007 - Qimonda AG, the former memory unit of Infineon, has announced the planned expansion of its existing facility for the assembly and testing of memory ICs (backend) in China's Suzhou Industrial Park.

03/12/2007  March 12, 2007 - Private equity firm CCMP Capital has reached agreement with The Linde Group, the global gases company, to acquire BOC Edwards, a leading manufacturer of vacuum equipment. The deal is valued at just over US$900M.

03/08/2007  Nanosys and Rockwell Collins partner on nano-enabled avionics displays

03/02/2007  March 2, 2007 - Varian Semiconductor Equipment Associates Inc. says it has increased the amount of funds to expend in its stock repurchase program from $300 million to $400 million, about half of which remains available for purchases.

03/01/2007  Georgia Tech researchers have used the semiconducting and piezoelectric properties of zinc oxide nanowires to create a new class of electronic components and devices that could provide the foundation for a broad range of new applications.