Materials

MATERIALS ARTICLES



Flexible hybrid electronics & sensors impacting the automotive industry

09/05/2017  FlexTech, a SEMI strategic association partner, will host a one-day Flexible Hybrid Electronics and Sensors Automotive Industry workshop in Detroit, Michigan on September 13, 2017 to explore how FHE adds functionality, decreases weight and impacts design. Automotive and electronics industry leaders will gather to discuss the market demands and challenges with automotive technology and present disruptive changes brought by flexible hybrid electronics (FHE) and sensors.

ASE K7 receives Green Factory Label

09/01/2017  Advanced Semiconductor Engineering, Inc, a semiconductor assembly and test service provider, announced that its K7 manufacturing facility in Kaohsiung has received the Green Factory Label from the Industrial Development Bureau, Ministry of Economic Affairs, Taiwan.

SiC & GaN technologies upset the traditional benchmarks of the IGBT industry

09/01/2017  How is the IGBT market evolving for different applications? How will the IGBT market face the adoption of high performance WBG based devices?

New device could turn heat energy into a viable fuel source

08/31/2017  A new device being developed by Washington State University physicist Yi Gu could one day turn the heat generated by a wide array of electronics into a usable fuel source.

Physicists learn how to create nanopores of specified size in graphene

08/30/2017  A group of international physicists, jointly with NUST MISIS researchers, have conducted a series of experiments on graphene bombardment by swift heavy ions.

Silicon solves problems for next-generation battery technology

08/30/2017  Silicon - the second most abundant element in the earth's crust - shows great promise in Li-ion batteries, according to new research from the University of Eastern Finland. By replacing graphite anodes with silicon, it is possible to quadruple anode capacity.

Nagoya-led team flips the switch on ferroelectrics

08/28/2017  Nagoya University-led team controls the configuration of domains in nanorod- and thin-film ferroelectric systems.

New results reveal high tunability of 2-D material

08/28/2017  Berkeley Lab-led team also provides most precise band gap measurement yet for hotly studied monolayer moly sulfide.

Bond dissociation energies for transition metal silicides accurately determined

08/23/2017  American researchers develop method to determine bond dissociation energies for transition metal silicides to advance computation efforts and general understanding of chemical bonding.

Semiconductor industry capital spending forecast to jump 20% in 2017

08/22/2017  Samsung remains the “wild card” with regard to 2H17 capital expenditures.

Large wafers, complex IC designs among advanced packaging trends

08/15/2017  The global semiconductor advanced packaging market is expected to grow at a CAGR of 8.45% during the period 2017-2021, according to Research and Markets.

Harnessing the properties of a remarkable 2-D material

08/10/2017  Researchers from A*STAR have developed a simple technique that could pave the way for its use in a wide range of new applications in energy storage, optoelectronic and flexible electronic devices

Landscapes give latitude to 2-D material designers

08/09/2017  Rice University, Oak Ridge scientists show growing atom-thin sheets on cones allows control of defects.

Rinchem announces expansion of infrastructure in South Korea

08/07/2017  Rinchem recently announced the expansion of its chemical distribution center in Pyeongtaek, South Korea.

Reality check for 'wonder material'

08/04/2017  Topological insulators, a class of materials which has been investigated for just over a decade, have been heralded as a new 'wonder material', as has graphene. But so far, topological insulators have not quite lived up to the expectations fueled by theoretical studies. University of Groningen physicists now have an idea about why.

Scientists discover new magnet with nearly massless charge carriers

08/04/2017  Advances in modern electronics has demanded the requisite hardware, transistors, to be smaller in each new iteration. Recent progress in nanotechnology has reduced the size of silicon transistors down to the order of 10 nanometers. However, for such small transistors, other physical effects set in, which limit their functionality. The recent discoveries of topological materials -- a new class of relativistic quantum materials -- hold great promise for use in energy saving electronics.

A semiconductor that can beat the heat

07/31/2017  Berkeley Lab, UC Berkeley scientists discover unique thermoelectric properties in cesium tin iodide.

Atomic discovery opens door to greener, faster, smaller electronic circuitry

07/26/2017  Scientists find way to correct communication pathways in silicon chips, making them perfect.

Scientists announce the quest for high-index materials

07/25/2017  A team of physicists featuring researchers from MIPT and ITMO University has conducted a comparative analysis of a range of materials to determine if they are applicable to dielectric nanophotonics. Their systematic study produced results that can optimize the use of known materials for building optical nanodevices, as well as encourage the search for new materials with superior properties.

Chemical route towards electronic devices in graphene

07/25/2017  Essential electronic components, such as diodes and tunnel barriers, can be incorporated in single graphene wires (nanoribbons) with atomic precision.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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