Materials

MATERIALS ARTICLES



Imec achieves record-low source/drain contact resistivity for PMOS transistors

06/08/2017  Imec is wrapping up at the Symposia on VLSI Technology this week with two announcements: the reporting of record breaking values below 10^-9 Ohm.cm² for PMOS source/drain contact resistivity and new process improvements for next generation devices.

Supply chain needs paradigm shift in how to look at defect control

06/07/2017  The future of contamination control in the next-generation supply chain for beyond 14nm-node semiconductor processes faces stringent challenges.

New diode features optically controlled capacitance

06/06/2017  Israeli researchers have developed a new optically tunable capacitor with embedded metal nanoparticles, creating a metal-insulator-semiconductor diode that is tunable by illumination.

Engineer unveils new spin on future of transistors with novel design

06/05/2017  All-carbon, spintronic proposal could lead to smaller, better performing structures in electronics.

New method of characterizing graphene

06/01/2017  Scientists have developed a new method of characterizing graphene's properties without applying disruptive electrical contacts, allowing them to investigate both the resistance and quantum capacitance of graphene and other two-dimensional materials. Researchers from the Swiss Nanoscience Institute and the University of Basel's Department of Physics reported their findings in the journal Physical Review Applied.

Volatility in electronic equipment supply chain

06/01/2017  SEMI’s year-to-date worldwide semiconductor equipment billings year-to-date through March show a 59.6 percent gain to the same period last year.

Engaging diamond for next-era transistors

05/22/2017  Materials scientists in Japan have developed a new diamond transistor fabrication process that promises to advance the development of more robust and energy-efficient electronics.

Next-gen solar cells could be improved by atomic-scale redesign

05/15/2017  Researchers have uncovered the exact mechanism that causes new solar cells to break down in air, paving the way for a solution.

Hafnia dons a new face

05/12/2017  As computer chips become smaller, faster and more powerful, their insulating layers must also be much more robust -- currently a limiting factor for semiconductor technology. A collaborative University of Kentucky-Texas A&M University research team says this new phase of hafnia is an order of magnitude better at withstanding applied fields.

Soitec names new VP of Strategic Business Development in China

05/11/2017  Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, has appointed Stephen Lin to the newly created position of vice president of strategic business development in China, a key region for the company's future growth plans.

At last: Beautiful, consistent carbon belts

05/11/2017  Synthesis of a carbon nanobelt with potential applications in nanotechnology.

Chemically tailored graphene

05/09/2017  Graphene is considered as one of the most promising new materials. However, the systematic insertion of chemically bound atoms and molecules to control its properties is still a major challenge. Now, for the first time, scientists of the Friedrich-Alexander-Universität Erlangen-Nürnberg, the University of Vienna, the Freie Universität Berlin and the University Yachay Tech in Ecuador succeeded in precisely verifying the spectral fingerprint of such compounds in both theory and experiment.

'Persistent photoconductivity' offers new tool for bioelectronics

05/03/2017  Researchers at North Carolina State University have developed a new approach for manipulating the behavior of cells on semiconductor materials, using light to alter the conductivity of the material itself.

Discovery of new PVD chalcogenide materials for memory applications

04/28/2017  A case study is presented based on the use of high throughput experimentation (HTE) for the discovery of new memory materials.

Wonder material? Novel nanotube structure strengthens thin films for flexible electronics

04/24/2017  Reflecting the structure of composites found in nature and the ancient world, researchers at the University of Illinois at Urbana-Champaign have synthesized thin carbon nanotube (CNT) textiles that exhibit both high electrical conductivity and a level of toughness that is about fifty times higher than copper films, currently used in electronics.

Conax Technologies announces the acquisition of Arizona-based Quartz Engineering

04/24/2017  Conax Technologies announced the acquisition of Quartz Engineering, a manufacturer of quartz sheaths for temperature sensors headquartered in Tempe, AZ.

Avantor acquires Puritan Products

04/21/2017  Avantor Performance Materials, LLC, announced today the acquisition of Puritan Products, Inc., a supplier of cGMP buffers and solutions for Biopharma customers, and high-purity chemistries for Research and Electronic Materials customers.

New ClassOne chamber cuts copper plating costs 95%

04/20/2017  ClassOne Technology announced it's new CopperMax chamber -- a design that is demonstrating major copper plating cost reductions for users of ?200mm wafers.

Brewer Science earns GreenCircle Certification for zero waste to landfill for second consecutive year

04/19/2017  Brewer Science announced the achievement of Zero Waste to Landfill Certification for the second consecutive year.

GaN Systems' investors receive Venture Capital Awards

04/17/2017  Investor of the Year, Chrysalix Venture Capital selected over 11,000 nominees Cycle Capital Management named Canada's 2nd most active VC in 2016.




WEBCASTS



Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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