08/08/2016  To continue advancing, next-generation electronic devices must fully exploit the nanoscale, where materials span just billionths of a meter. But balancing complexity, precision, and manufacturing scalability on such fantastically small scales is inevitably difficult.

08/03/2016  Method to reinforce these materials could help make airplane frames lighter, more damage-resistant.

07/27/2016  A team of scientists led by the Department of Energy's Oak Ridge National Laboratory has developed a novel way to produce two-dimensional nanosheets by separating bulk materials with nontoxic liquid nitrogen.

07/27/2016  Engineers from the University of Utah and the University of Minnesota have discovered that interfacing two particular oxide-based materials makes them highly conductive, a boon for future electronics that could result in much more power-efficient laptops, electric cars and home appliances that also don't need cumbersome power supplies.

07/25/2016  New levels of performance of electronics technology have been enabled by flip-chip technology, fueling the growth of global markets for semiconductors, electronic devices, and a host of industrial and consumer products.

07/25/2016  Rice University lab studies 2-D hybrids to see how they differ from common electronics.

07/21/2016  Researchers from North Carolina State University and the U.S. Army Research Office have developed a way to integrate novel functional materials onto a computer chip, allowing the creation of new smart devices and systems.

07/20/2016  University of Iowa physicist says current in one iron magnetic sheet can create quantized spin waves in another, separate sheet.

07/19/2016  With an eye to the next generation of tech gadgetry, a team of physicists at The University of Texas at Austin has had the first-ever glimpse into what happens inside an atomically thin semiconductor device.

07/18/2016  The efficient detection of low-energy photons constitutes one of the main challenges faced by future optoelectronics. Finding new ways of sensing and harvesting these photons is crucial for the development of technologies such as silicon photonics, pollution sensing and next-generation solar.

07/13/2016  Wenge Yang of Entegris spoke with the Show Daily about major trends in High Volume Manufacturing (HVM), and about the topics that will be discussed in the Entegris Yield Breakfast Forum “Yield Enhancement Challenges in Today’s Memory IC Production” happening Thursday morning, July 14.

07/13/2016  Cisco VP urges conference goers to invest in digitized supply chains to stay relevant.

07/11/2016  Synopsys' Process Explorer and Raphael accurately simulate parasitic resistance of alternative metals and liner-barrier materials at the 7nm node and beyond.

07/08/2016  3D-Micromac AG announced that its microDICE laser micromachining system has been adopted by a major industrial manufacturer for volume production of high-power diodes.

07/05/2016  Voltage-controlled oscillator developed at UC Riverside could be used in thousands of applications from computers to wearable technologies.

07/01/2016  AMICRA Microtechnologies, a German-based vendor of advanced back-end assembly processing equipment for advanced packaging applications, has received an order for the AFC Plus System from Fabrinet West.

06/30/2016  Techcet forecasts $3.9B gas business for 2016.

06/29/2016  A new roadmap, the Heterogeneous Integration Technology Roadmap for Semiconductors (HITRS), aims to integrate fast optical communication made possible with photonic devices.

06/23/2016  For fan-out wafer-level packaging and 3D packaging, thin wafer handling is critical; the wafer must not warp, bend or shift during any wafer-processing steps.

06/22/2016  Physicists from the Technological Institute for Superhard and Novel Carbon Materials, the Moscow Institute of Physics and Technology, and the Siberian Federal University have mathematically modelled diamond-based microstructures for producing compact high sensitivity sensors.