Materials

MATERIALS ARTICLES



Spin dynamics in an atomically thin semiconductor

02/02/2016  Researchers at the National University of Singapore and Yale-NUS College have established the mechanisms for spin motion in molybdenum disulfide, an emerging 2-dimensional material.

Electrons and liquid helium advance understanding of zero-resistance

02/01/2016  The end of Moore's Law -- the prediction that transistor density would double every two years -- was one of the hottest topics in electronics-related discussions in 2015.

Epiluvac and SAMCO collaborate to offer processing equipment for WBG materials in Nordic countries

02/01/2016  Sweden-based SiC CVD developer and manufacturer Epiluvac AB has entered into a collaboration with SAMCO, a semiconductor process equipment developer and manufacturer based in Japan, in which Epiluvac will introduce new clients to SAMCO in Sweden, Norway, Finland and Denmark.

A new approach to chip fabrication

01/29/2016  MIT researchers and their colleagues report the first chip-fabrication technique that enables significantly different materials to be deposited in the same layer.

Breakthrough enables ultra-fast transport of electrical charges in polymers

01/28/2016  A research team at Umeå University in Sweden has showed, for the first time, that a very efficient vertical charge transport in semiconducting polymers is possible by controlled chain and crystallite orientation.

IBS report electric transport across molybdenum disulfide grain boundaries

01/27/2016  The Center for Integrated Nanostructure Physics (CINAP) within IBS has reported results correlating the flake merging angle with grain boundary (GBs) properties, and proven that increasing the merging angle of GBs drastically improves the flow of electrons.

Fujifilm to build a new plant for advanced semiconductor materials in Taiwan

01/22/2016  Fujifilm Corporation recently announced that its semiconductor business subsidiary, FUJIFILM Electronic Materials Co.,Ltd. will build a new plant for manufacturing advanced semiconductor materials in the city of Tainan, to expand its production in Taiwan.

New process enables easier isolation of carbon nanotubes

01/20/2016  A newly developed method has opened up new possibilities in carbon nanotube development.

Switchable material could enable new memory chips

01/20/2016  Two MIT researchers have developed a thin-film material whose phase and electrical properties can be switched between metallic and semiconducting simply by applying a small voltage.

Bismuth-based nanoribbons show 'topological' transport, potential for new technologies

01/19/2016  Researchers have created nanoribbons of an emerging class of materials called topological insulators and used a magnetic field to control their semiconductor properties, a step toward harnessing the technology to study exotic physics and building new spintronic devices or quantum computers.

Uncovering oxygen's role in enhancing red LEDs

01/13/2016  While oxygen can impede the effectiveness of gallium nitride (GaN), an enabling material for LEDs, small amounts of oxygen in some cases are needed to enhance the devices' optical properties.

Stanford researchers advance area selective ALD to develop more energy efficient electronics

01/12/2016  Stanford University researchers sponsored by Semiconductor Research Corporation (SRC) have developed a new area selective atomic layer deposition (ALD) process that promises to accelerate the manufacturing of higher performing, more energy efficient semiconductors.

Visualizing atoms of perovskite crystals

01/08/2016  OIST researchers conduct the first atomic resolution study of perovskites used in next generation solar cells.

Worldwide semiconductor revenue declined 1.9% in 2015, Gartner reports

01/08/2016  Worldwide semiconductor revenue totaled $333.7 billion in 2015, a 1.9 percent decrease from 2014 revenue of $340.3 billion, according to preliminary results by Gartner, Inc.

AKHAN Semiconductor deploys 200mm manufacturing process in new diamond-based chip production facility

01/08/2016  AKHAN Semiconductor, Inc. this week announced that it is deploying 200mm manufacturing equipment and process in its new production facility in Gurnee, Illinois, continuing its preparation for delivering AKHAN diamond semiconductor based-technology products to the company’s first commercial customer this quarter.

Electronically connected graphene nanoribbons foresee high-speed electronics

01/08/2016  Chemical interconnection bridges electronic properties of graphene-nanoribbons with zigzag-edge features.

Wide Band Gap technologies: An opportunity to increase power devices performance

01/08/2016  When people think about Wide Band Gap (WBG) materials for power electronics applications, they usually think of GaN or SiC. However, there are materials with an even larger band gap which can further increase power device performance.

Researchers gauge quantum properties of nanotubes, essential for next-gen electronics

01/07/2016  Imaging method allowed researchers to measure the nanotube quantum capacitance-a very unique property of an object from the nano-world.

The Critical Materials Council to be managed by TECHCET in 2016

01/07/2016  The Critical Materials Council for Semiconductor Fabricators, originally established by ISMI/SEMATECH in the early 1990’s, will be managed by TECHCET CA LLC starting January 01, 2016.

Promising new approach for controlled fabrication of carbon nanostructures

01/05/2016  An international team of researchers including Professor Federico Rosei and members of his group at INRS has developed a new strategy for fabricating atomically controlled carbon nanostructures used in molecular carbon-based electronics.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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