Materials

MATERIALS ARTICLES



Theorists find mechanism behind nearly pure nanotubes from the unusual catalyst

07/27/2018  Growing a batch of carbon nanotubes that are all the same may not be as simple as researchers had hoped, according to Rice University scientists.

And then there was (more) light: Researchers boost performance quality of perovskites

07/26/2018  In a paper published online this spring in the journal Nature Photonics, scientists at the University of Washington report that a prototype semiconductor thin-film has performed even better than today's best solar cell materials at emitting light.

Semiconductor Research Corporation releases $26M in new research funds

07/26/2018  JUMP program funds 24 new research projects to amplify mission of its six innovation centers.

Applied Materials team selected by DARPA to develop advanced technology for artificial intelligence

07/24/2018  Applied Materials, Inc. today announced it has been awarded a contract by the Defense Advanced Research Projects Agency (DARPA) to develop a new type of electronic switch for artificial intelligence that mimics the way the human brain works to enable dramatic improvements in performance and power efficiency.

Apple is changing GaAs' future

07/23/2018  3D sensing in mobile phone as well as LiDAR’s applications are giving a new breath for GaAs substrates suppliers.

Nanocrystals emit light by efficiently 'tunneling' electrons

07/23/2018  Using advanced fabrication techniques, engineers at the University of California San Diego have built a nanosized device out of silver crystals that can generate light by efficiently "tunneling" electrons through a tiny barrier. The work brings plasmonics research a step closer to realizing ultra-compact light sources for high-speed, optical data processing and other on-chip applications.

SEMI China Equipment & Materials Committee meeting targets region's semiconductor industry growth

07/20/2018  Storage and memory chipmaker and SEMI China member Tsinghua Unigroup is gearing up to meet burgeoning product demand with huge investments in its manufacturing plants.

Rahul Goyal of Intel elected Board Chair of Silicon Integration Initiative

07/19/2018  Rahul Goyal of Intel has been elected to a one-year term as board chair of Silicon Integration Initiative, a research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

Puzzling results explained: A multiband approach to Coulomb drag and indirect excitons

07/19/2018  A new theoretical study explains previous mystifying experimental results, in which coupled charged particles moved in exactly the opposite direction to that predicted. This apparently contradictory phenomenon is associated with the bandgap in dual-layer graphene structures, a bandgap which is very much smaller than in conventional semiconductors.

UCLA engineers develop world's most efficient semiconductor for thermal management

07/19/2018  New material draws heat away from hotspots much faster than current materials.

Gold nanoparticles to find applications in hydrogen economy

07/18/2018  The international team of scientist found a way to improve nanocomposite material to use it in hydrogen economy.

A step closer to quantum computers: NUS researchers show how to directly observe quantum spin effects

07/17/2018  Scientists at NUS have discovered a new way to closely look at the electronic quantum behaviour of materials, giving a deeper understanding of how they could be used for future quantum computing applications.

New regulations coming for nitrous oxide

07/12/2018  Nitrous oxide (N2O) has a variety of uses in the semiconductor manufacturing industry. It is the oxygen source for chemical vapor deposition of silicon oxy-nitride (doped or undoped) or silicon dioxide, where it is used in conjunction with deposition gases such as silane.

Leti and Soitec launch a new substrate innovation center to develop engineered substrate solutions

07/11/2018  Industry-inclusive hub promotes early collaboration and learning from substrate to system level.

Intel wins SEMI Award at SEMICON West for process and integration

07/11/2018  Intel has won SEMI's 2018 Award for the Americas. SEMI honored the celebrated chipmaker for pioneering process and integration breakthroughs that enabled the first high-volume Integrated Silicon Photonics Transceiver. The award was presented yesterday at SEMICON West 2018.

Standards industry leaders honored at SEMICON West 2018

07/11/2018  SEMI yesterday honored two industry leaders at SEMICON West 2018 for their outstanding accomplishments in developing Standards for the electronics and related industries.

High gas flow rates create pumping challenge

07/10/2018  Increasingly complicated 3D structures such finFETs and 3D NAND require very high aspect ratio etches. This, in turn, calls for higher gas flow rates to improve selectivity and profile control. Higher gas flow rates also mean higher etch rates, which help throughput, and  higher rates of removal for etch byproducts.

Void control in die attach joint

07/09/2018  To eliminate voids, it is important to control the process to minimize moisture absorption and optimize a curing profile for die attach materials.

Heat-conducting crystals could help computer chips keep their cool

07/06/2018  Researchers at the University of Texas at Dallas and their collaborators have created and characterized tiny crystals of boron arsenide.

High performance nitride semiconductor for environmentally friendly photovoltaics

07/03/2018  A Tokyo Institute of Technology research team has shown copper nitride acts as an n-type semiconductor, with p-type conduction provided by fluorine doping, utilizing a unique nitriding technique applicable for mass production and a computational search for appropriate doping elements, as well as atomically resolved microscopy and electronic structure analysis using synchrotron radiation.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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