02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

02/21/2018  Despite increasing costs of development, IC manufacturers are still making great strides.

02/21/2018  Nanoscale light sources and nanoantennas already found a wide range of applications in several areas, such as ultra compact pixels, optical detection or telecommunications.

02/21/2018  Combined memristor and transistor can process information and store memory with one device.

02/16/2018  Since Apple unveiled iPhone X with face-recognition functionality in early November 2017, interest in 3D sensing technology has reached fever pitch and attracted huge investments across the related supply chains.

02/15/2018  A silicon-based quantum computing device could be closer than ever due to a new experimental device that demonstrates the potential to use light as a messenger to connect quantum bits of information -- known as qubits -- that are not immediately adjacent to each other. The feat is a step toward making quantum computing devices from silicon, the same material used in today's smartphones and computers.

02/15/2018  A new smart and responsive material can stiffen up like a worked-out muscle, say the Iowa State University engineers who developed it.

02/15/2018  Siemens announced it has entered into an agreement to acquire Oulu, Finland-based Sarokal Test Systems Oy.

02/14/2018  Scalable and cost-effective manufacturing of thin film devices.

02/13/2018  The 2018 FLEXI Awards today recognized groundbreaking accomplishments in the Flexible Hybrid Electronics (FHE) sector in 2017.

02/13/2018  CEA-Leti's chief scientist today issued a forward-looking call to action for the microelectronics industry to create a radically new, digital-communication architecture for the Internet of Things in which "a great deal of analytics processing occurs at the edge and at the end devices instead of in the Cloud".

02/13/2018  SEMI today announced the appointment of Frank A. Shemansky, Jr., Ph.D., as executive director and chief technology officer (CTO) of the MEMS & Sensors Industry Group (SEMI-MSIG).

02/12/2018  MagnaChip Semiconductor Corporation announced today it now offers the 2nd generation of 0.13 micron BCD process technology integrated with high-density embedded Flash memory.

02/12/2018  Breakthrough for high-throughput cell assays and characterization of complex cell behavior and interaction.

02/12/2018  NUST MISIS scientists jointly with an international group of scientists have managed to develop a composite material that has the best piezoelectric properties today. The research results were published in Scientific Reports journal.

02/08/2018  Delivering a keynote talk during the Feb. 12 plenary session that formally opens the conference, De Salvo will note that the architecture will include human-brain inspired hardware coupled to new computing paradigms and algorithms that "will allow for distributed intelligence over the whole IoT network, all-the-way down to ultralow-power end-devices."

02/07/2018  SiTime Corporation, a developer of MEMS timing devices, announced today that it has shipped cumulatively over 1 billion timing devices.

02/07/2018  University of Cincinnati engineering professor Jason Heikenfeld maps the progress and untapped potential of wearable sensors in a critical review of the research field.

02/07/2018  MACOM Technology Solutions Holdings, Inc. and STMicroelectronics announced an agreement to develop GaN (Gallium Nitride) on Silicon wafers to be manufactured by ST for MACOM's use across an array of RF applications.

02/06/2018  Market shares of top semiconductor equipment manufacturers for the full year 2017 indicate large gains by Tokyo Electron and Lam Research while top supplier Applied Materials dropped.