01/17/2018  ASML Holding N.V. (ASML) today announces that the Supervisory Board intends to appoint Roger Dassen as Executive Vice President and Chief Financial Officer (CFO) to the Board of Management.

01/12/2018  Amid market consolidation, the top four PC vendors accounted for 64% of shipments in 2017.

01/12/2018  The lawsuit covers three areas that allegedly infringe upon UMC’s patent rights in China, including specific memory applications that relate to DDR4, SSD and memory used in graphics cards.

01/11/2018  SEMI today announced that Luc Van den hove, president and CEO of imec, has been selected as the 2018 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham. He will be honored for outstanding achievement in semiconductor equipment and materials marketing during ceremonies at ISS 2018 on January 17 in Half Moon Bay, California.

01/11/2018  Boston Semi Equipment (BSE), a global semiconductor test handler manufacturer and provider of test automation technical services, announced today that it has received a multisystem order for its Zeus gravity feed systems for handling pressure MEMS devices.

01/10/2018  These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider.

01/10/2018  Easily printable, organic thin films can retain data for more than 10 years without power, work with low voltages -- and become the building block of future computers that mimic the human brain.

01/08/2018  Semtech Corporation, a supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced its next generation LoRa devices and wireless radio frequency (RF) technology (LoRa Technology) chipsets enabling innovative LPWAN use cases for consumers with its advanced technology.

01/08/2018  With integration complete, FOA is managed as a Special Interest Group (SIG) within SEMI. FOA member companies will become full SEMI members, with FOA continuing to expand its global membership through SEMI's global network, while maintaining its unique community.

01/05/2018  ON Semiconductor has joined the global Charging Interface Initiative e.V. (CharIN) ecosystem with the goals of promoting standards for charging systems in electric vehicles.

01/05/2018  A team of physicists, headed by the U.S. Naval Research Laboratory (NRL), have demonstrated the means to improve the optical loss characteristics and transmission efficiency of hexagonal boron nitride devices, enabling very small lasers and nanoscale optics.

01/05/2018  At the SEMI Standards Friendship Party during SEMICON Japan, JRSC recognized the following nine committee members for outstanding contributions to the development of SEMI Standards.

01/04/2018  From the Internet of Things to the cloud to artificial intelligence, industries are seeing a new wave of technologies that have the potential to transform and significantly impact the world around us.

01/04/2018  Two Chinese companies -- HiSilicon and Unigroup -- are among the top 10 fabless IC sales leaders.

01/03/2018  Worldwide market notches highest-ever monthly sales of $37.7 billion; sales increase 1.6 percent compared to October.

01/03/2018  An alternative for power-efficient portable HDR displays, in Notebook, Tablet, SmartPhone, Monitor, TV, AR, and VR applications.

01/03/2018  STMicroelectronics (NYSE:STM) and USound, a fast-growing audio company, have delivered the first silicon micro-speakers resulting from their technology collaboration announced last year.

01/03/2018  The year-end update to the SEMI World Fab Forecast report reveals 2017 spending on fab equipment investments will reach an all-time high of $57 billion.

01/02/2018  Scientists at Tokyo Institute of Technology (Tokyo Tech) and their research team involving researchers of JASRI, Osaka University, Nagoya Institute of Technology, and Nara Institute of Science and Technology have just developed a novel approach to determine and visualize the three-dimensional (3D) structure of individual dopant atoms using SPring-8.

12/20/2017  New embedded transducer approach allows surface acoustic wave device to transmit signals with six times the speed of most commercially used devices.