07/26/2017  Issued every two years, Bosch’s coveted awards recognize companies that have demonstrated outstanding performance in the manufacture and supply of products or services to Bosch.

07/26/2017  Through the first half of the year, 2017 equipment billings are 50 percent above the same period last year.

07/24/2017  A new electrochemical energy harvesting device developed at Vanderbilt University can generate electrical current from the full range of human motions and is thin enough to embed in clothing.

07/24/2017  Novel method of propagating spin waves could pave the way for high-speed, miniaturized data processing devices.

07/21/2017  Worldwide PC shipments totaled 61.1 million units in the second quarter of 2017, a 4.3 percent decline from the second quarter of 2016, according to preliminary results by Gartner, Inc.

07/17/2017  MagnaChip Semiconductor Corporation announced today it was selected as a foundry partner by ELAN Microelectronics to manufacture the world's first fingerprint sensor IC-based smartcard.

07/17/2017  A hypoallergenic electronic sensor can be worn on the skin continuously for a week without discomfort, and is so light and thin that users forget they even have it on, says a Japanese group of scientists.

07/17/2017  Transistors, as used in billions on every computer chip, are nowadays based on semiconductor-type materials, usually silicon. As the demands for computer chips in laptops, tablets and smartphones continue to rise, new possibilities are being sought out to fabricate them inexpensively, energy-saving and flexibly.

07/17/2017  Scientists from the Moscow Institute of Physics and Technology (MIPT) and the Kotelnikov Institute of Radio Engineering and Electronics (IRE) of the Russian Academy of Sciences (RAS), in collaboration with their colleagues from Finland, have developed a new type of optical fiber that has an extremely large core diameter and preserves the coherent properties of light.

07/13/2017  Digital disruption begets innovation. Challenges equal opportunities.

07/12/2017  Keynote speakers Terry Higashi of Tokyo Electron Ltd. and Tom Caulfield of GlobalFoundries took the stage at the Yerba Buena Theater Tuesday morning to predict major changes in the goals and operations of the semiconductor industry.

07/11/2017  MEMS & Sensors Industry Group (MSIG), the industry association advancing MEMS and sensors across global markets, is hosting a TechXPOT program today, titled “What’s Next for MEMS & Sensors: Big Growth of Disruptive Applications for Smart Sensing Changes the Business.”

07/11/2017  In the advanced CMOS technology programs ongoing in the Belgium city of Leuven, imec works to extend the building-blocks of integrated circuits (IC).

07/10/2017  Boston Semi Equipment (BSE), a global semiconductor test handler company, announced today it has received a follow on order for multiple Zeus gravity test handling systems for pressure MEMS.

07/10/2017  At its annual Imec Technology Forum USA in San Francisco, imec today presented an electrically functional solution for the 5nm back-end-of-line (BEOL).

06/29/2017  Presto Engineering, Inc., an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announces a management expansion: Cedric Mayor has been named Chief Operating Officer (COO) and Martin Kingdon has been appointed VP Sales.

06/28/2017  Embedded imaging applications in cars, security, machine vision, medical, virtual reality, wearable systems, and other new uses will offset slow growth in camera phones, says O-S-D Report.

06/20/2017  What if the automotive industry had achieved the incredible pace of innovation as the semiconductor industry during the last 52 years?

06/20/2017  Industry experts answer questions about the new standard in a virtual roundtable.

06/20/2017  ULVAC Technologies, Inc., a supplier of production systems, instrumentation and vacuum pumps for technology industries, has opened an office in Santa Clara, California.