03/20/2017  It takes a range of skills to create a successful business in the Internet of Things space, where chips sell for a few dollars and competition is intense. Circuit design and software support for multiple wireless standards must combine with manufacturing capabilities.

03/20/2017  SEMI today announced that it has moved its headquarters office to Milpitas, Calif.

03/15/2017  STMicroelectronics, a global semiconductor and a top MEMS supplier, and iFLYTEK, a voice-recognition cloud service provider in China, have introduced the market's first IoT development platform that enables voice-recognition cloud services in Chinese.

03/14/2017  The ConFab announces keynotes in the May 14-17 event being held at the Hotel del Coronado in San Diego.

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

03/09/2017  NXP Semiconductors today announced the world's smallest single-chip SoC solution -- the MC9S08SUx microcontroller (MCU) family -- with an integrated 18V-to-5V LDO and MOSFET pre-driver that delivers ultra-high-voltage solution for drones, robots, power tools, DC fan, healthcare and other low-end brushless DC electric motor control (BLDC) applications.

03/09/2017  Imec and Holst Centre (initiated by imec and TNO) have developed a novel phase-tracking receiver bringing further power and cost reduction for the next generations of Bluetooth and IEEE802.15.4 radio chips.

03/08/2017  Researchers at the Technical University of Munich (TUM) have, for the first time ever, produced a composite material combining silicon nanosheets and a polymer that is both UV-resistant and easy to process.

03/08/2017  ST and Eutelsat complete development of chip for Eutelsat's next-generation SmartLNB.

03/07/2017  In a significant advance, particularly within the microelectronics realm, University of Massachusetts Amherst engineers have established electrical surface treatment of conducting thin films as a physical processing method to reduce surface roughness.

03/07/2017  Radiation hardness of e-mode devices confirm maturity of imec’s 200mm GaN-on-Si platform.

03/06/2017  In 2016, the Nano-Bio Manufacturing Consortium (NBMC), a FlexTech-managed consortium focused on human performance monitoring technology, and funded in part by the Air Force Research Laboratories (AFRL), contracted with a broad-based team of industry and academia researchers, to develop a wearable monitor based on sweat analysis.

03/03/2017  Potassium-sensitive fluorescence-imaging method shines light on chemical activity within the brain.

03/02/2017  Manufacturers, suppliers and academia gather to understand the road ahead.

03/01/2017  ULVAC Technologies, Inc. has been selected by a global MEMS inertial sensor manufacturer to deliver an ULVAC ENVIRO-1Xa advanced plasma ashing system for running critical low-temp descum processes and high-temp bulk photoresist strip processes.

02/27/2017  Rice University researchers simulate two-dimensional hybrids for optoelectronics.

02/27/2017  Ultra-low power voice processing and MEMS microphone circuitry enables sound detection and keyword recognition in a miniaturized single package.

02/23/2017  STMicroelectronics (NYSE: STM) announced the expansion of its STSAFE family of secure elements with the introduction of a powerful plug-and-play solution that provides state-of-the-art security features to devices connected to the Sigfox low-power wide-area network (LPWAN).

02/22/2017  Toyohashi University of Technology researchers have developed microhotplates (MHPs), in which an SU-8 photoresist was employed as a supporting material. The MHP can moderate the requirement for the layout design and the process condition of integrated smart gas sensors.

02/22/2017  Process uses household inkjet printer without soldering to create 750nm-thin elastomeric sheet.