MEMS

MEMS ARTICLES



Do not go where the path may lead

01/27/2017  What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.

Executive viewpoints: 2017 outlook

01/25/2017  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

ams announces completion of transaction to acquire Heptagon

01/25/2017  ams, a worldwide supplier of high-performance sensor and analog solutions, announces the completion of the transaction to acquire 100% of the shares in Heptagon and related capital.

ISS Europe 2017: European innovation leadership

01/24/2017  Electronics manufacturing solutions for Automotive, Smart Manufacturing and Healthcare enabling the future of European technology.

New report from IHS Markit names top four trends driving the IoT in 2017 and beyond

01/24/2017  Fueled by lightning-fast demand for ubiquitous connectivity, the number of connected Internet of Things (IoT) devices globally will jump by 15 percent year-over-year to 20 billion in 2017, according to new analysis from IHS Markit.

New low-cost technique converts bulk alloys to oxide nanowires

01/20/2017  A simple technique for producing oxide nanowires directly from bulk materials could dramatically lower the cost of producing the one-dimensional (1D) nanostructures.

Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding

01/20/2017  Breakthrough results pave the way to multi-layer 3D ICs with high density interconnects realized by automated wafer-to-wafer bonding technology.

ams launches world’s first digital multispectral sensor-on-chip leveraging breakthrough wafer-level filter technology

01/17/2017  ams AG today launched the world's first series of cost-effective multispectral sensor-on-chip solutions, opening the way for a new generation of spectral analyzers for consumer and industrial applications.

HID Global predicts top trends for 2017 in the identity technology industry

01/11/2017  Shift in the use of trusted identities fuels broader adoption of mobile and advanced smart card technology, a greater emphasis on the Cloud and emerging IoT use cases.

STMicroelectronics incorporates CWS’ SiPEX in the RF PDK H9 SOI FEM

01/11/2017  Coupling Wave Solutions, S.A. and STMicroelectronics today announced that they partnered together to reduce time-to-market for high-performance radio frequency (RF) silicon-on-insulator (SOI) designs

NIST physicists 'squeeze' light to cool microscopic drum below quantum limit

01/11/2017  Physicists at the National Institute of Standards and Technology (NIST) have cooled a mechanical object to a temperature lower than previously thought possible, below the so-called "quantum limit."

Researchers create practical and versatile microscopic optomechanical device

01/09/2017  Trapping light and mechanical waves within a tiny bullseye, design could enable more sensitive motion detection.

Microsemi honored as M2M Network Equipment Technology Company of the Year by IoT Breakthrough Awards

01/06/2017  Microsemi Corporation, a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it was named M2M Network Equipment Technology Company of the Year by the inaugural IoT Breakthrough Awards.

imec collaborates with City of Antwerp and Flanders to establish Smart City Living Lab

01/06/2017  How can the Internet of Things change the future of the average citizen? To answer this question, imec joins forces with the City of Antwerp and the Flanders region to turn Antwerp into a Living Lab in which businesses, researchers, local residents and the city itself will experiment with smart technologies that aim to make urban life more pleasant, enjoyable and sustainable.

Vesper and DSP Group demo near-zero-power voice-activation for battery-powered devices at CES 2017

01/05/2017  Vesper, DSP Group and Sensory will demonstrate their new development platform from January 5-8, 2017 during CES 2017.

Intel to acquire 15% ownership of HERE

01/04/2017  Intel has agreed to purchase a 15 percent ownership stake in HERE, a global provider of digital maps and location-based services, from HERE’s current indirect shareholders.

Bosch launches smallest high performance barometric pressure sensor at CES 2017

01/04/2017  Today, Bosch Sensortec launches the BMP380, the company's smallest and best performing barometric pressure sensor, with a compact size of only 2.0 x 2.0 x 0.75 mm3.

Gartner forecasts flat worldwide device shipments until 2018

01/04/2017  Emerging devices can enhance conventional device sales.

Industry 4.0: What does it mean to the semiconductor industry?

12/23/2016  Adding intelligence to materials and products facilitates the fully decentralized operations model associated with Industry 4.0.

A year in review: Top 10 stories of 2016

12/23/2016  From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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