MEMS

MEMS ARTICLES



Leti and Institute for Information Industry of Taiwan partner on technologies for IoT, 5G

10/04/2016  The five-year collaboration will include, but is not limited to, joint development and implementation of IoT and 5G based Smart ICT solutions for the EU and Taiwan, and scientific information exchanges.

imec and Holst Centre present the world's most energy-efficient biomedical sensor hub

10/04/2016  imec and Holst Centre (established by imec and TNO), today announced a new sensor hub integrated as a system-on-chip (SoC) intended for a broad range of wearable health devices and applications.

Silicon Labs acquires leading RTOS company Micrium

10/03/2016  Silicon Labs today announced the acquisition of Micrium, a supplier of real-time operating system (RTOS) software for the Internet of Things (IoT).

STMicroelectronics' semiconductors chips contribute to connected toothbrush from Oral-B

10/03/2016  STMicroelectronics (NYSE: STM) today revealed its contributions to an intelligent toothbrush system from Oral-B.

Leti to tackle tomorrow's research strategies with Stanford SystemX Alliance

10/03/2016  Leti, an institute of CEA Tech, announced today it has joined the Stanford SystemX Alliance, a network of 100 renowned Stanford University professors and 27 world-class companies, joining forces in a pre-competitive environment to define tomorrow's research strategies.

New design contest encourages developers to build innovative sensing applications

09/30/2016  Cypress Semiconductor Corp. (Nasdaq: CY) and Hackster today announced a global design competition that gives engineers the opportunity to prototype their innovative ideas that sense the world around us for use in the growing Internet of Things (IoT) market, home appliances, and consumer and industrial applications.

SiTime introduces high-precision MEMS oscillators

09/27/2016  SiTime Corporation today introduced an innovative Elite Platform encompassing Super-TCXOs (temperature compensated oscillators) and oscillators.

Process Watch: Salami slicing your yield

09/26/2016  The Process Watch series explores key concepts about process control -- defect inspection and metrology -- for the semiconductor industry. This new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing.

MEMS & Sensors Industry Group highlights near-term and future connected tech at annual Executive Conference

09/26/2016  MEMS & Sensors Industry Group (MSIG) today announced highlights of its twelfth annual business conference, MEMS & Sensors Executive Congress 2016 in Scottsdale, AZ on November 9-11, 2016.

EV Group extends volume manufacturing expertise to biotech and medical applications

09/26/2016  EV Group today announced that it is increasing its focus on bringing its high-volume manufacturing process solutions and services to the biotechnology and medical device market.

NIST illuminates transfer of nanoscale motion through microscale machine

09/23/2016  For the first time, the NIST researchers have measured the transfer of motion through the contacting parts of a microelectromechanical system at nanometer and microradian scales.

Synopsys and TSMC collaborate to certify Custom Compiler for 16FFC process

09/22/2016  Synopsys, Inc. today announced a collaboration with TSMC to complete the certification for its 16-nanometer (nm) FinFET Compact (16FFC) process for a suite of Synopsys' digital, custom and signoff tools from the Galaxy Design Platform.

Leti orders HERCULES NIL system from EV Group for joint nanoimprint lithography program

09/21/2016  EV Group (EVG) and Leti, an institute of CEA Tech, announced today that Leti has ordered a HERCULES NIL track system from EV Group.

A changing industry

09/21/2016  The semiconductor industry is changing in some big ways. Demand for PCs and mobile devices – once the main drivers of growth – has slowed.

Solid State Technology announces expanded conference for The ConFab 2017

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

Moore's Law did indeed stop at 28nm

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

Thorlabs deploys manufacturing infrastructure to expand piezo chip/stack line

09/16/2016  Thorlabs has expanded its piezoelectric line to include new types of piezoelectric actuators, low?voltage piezoelectric chips, and discrete stacks with through holes, enabling a higher level of flexibility when integrating the actuators into other devices.

SEMI and MSIG join together in strategic association partnership

09/15/2016  SEMI announced that MEMS & Sensors Industry Group (MSIG) will become a SEMI Strategic Association Partner effective January 1, 2017.

Actions Semiconductor enters into merger agreement for going private transaction

09/14/2016  Actions Semiconductor Co., Ltd. today announced that it has entered into a definitive merger agreement on September 12, 2016 pursuant to which the Company will be acquired by a consortium of investors.

The future of Europe pitch their startups at SEMICON Europa's Innovation Village

09/14/2016  SEMI today announced that twenty-one start-ups have been selected to pitch to investors and exhibit their products at SEMICON Europa's INNOVATION VILLAGE in Grenoble, France at the Alpexpo from 25-27 October, 2016.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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