MEMS

MEMS ARTICLES



Imec scientist awarded ERC Starting Grant to develop breakthrough flexible electronics

09/13/2016  Nanoelectronics research center imec announces that Kris Myny, one of its young scientists, has been awarded an ERC Starting Grant.

SEMI’s new interactive mobile fab forecast: SEMI FabView

09/13/2016  SEMI, a supplier of independent semiconductor market research, today announced SEMI FabView, a mobile-friendly, interactive version of its popular World Fab Forecast quarterly report for electronic supply chain players and analysts.

High-volume processes for next-generation biotechnology devices

09/12/2016  Over the past several decades, miniaturization has significantly improved clinical diagnostics, pharmaceutical research and analytical chemistry. Modern biotechnology devices— such as biosensors, fully integrated systems for diagnostics, cell-analysis or drug discovery—are often chip-based and rely on close interaction of biological substances at the micro- and nanoscale. Thus, process technologies that enable the production of surface patterns and integration of fluidic components with small feature sizes are needed.

Fab equipment spending ascending

09/08/2016  Expect 4% growth (YoY) for 2016 and 11% for 2017

IC Insights updates semiconductor outlook for Internet of Things

09/07/2016  Lower sales projections for connected cities leads to reduced semiconductor IoT market forecast.

SEMI European MEMS Summit brings industry leaders to Stuttgart

09/06/2016  Leading sensors and actuators companies will present the latest trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September 2016.

Thinner wafers are fostering the growth and emergence of new dicing technologies

09/06/2016  Driven by rising demand for thinner wafers and stronger die, dicing technology is evolving.

Top 4 drivers leading to the growth of the RF IC market

09/02/2016  Technavio analysts forecast the global radio frequency (RF) IC market to grow at a CAGR of nearly 12% during the forecast period, according to their latest report.

Iowa State engineers treat printed graphene with lasers to enable paper electronics

09/02/2016  Iowa State engineers have led development of a laser-treatment process that allows them to use printed graphene for electric circuits and electrodes -- even on paper and other fragile surfaces. The technology could lead to many real-world, low-cost applications for printed graphene electronics, including sensors, fuel cells and medical devices.

Memory for future wearable electronics

09/02/2016  Stretchable, flexible, reliable memory device inspired by the brain.

MCU market forecast to reach record high revenues through 2020

08/30/2016  After recent years of price erosion, MCU ASPs are forecast to rise and help lift sales to new highs.

Global MEMS market to grow at a CAGR of close to 12% until 2020

08/26/2016  According to the latest market study released by Technavio, the global micro-electro-mechanical-systems (MEMS) market is expected to reach USD 20.26 billion by 2020, growing at a CAGR of nearly 12%.

S. Korean University employs Advanced Vacuum plasma systems in nanotechnology research

08/24/2016  A leading South Korean research university has successfully integrated two Advanced Vacuum plasma processing systems from Plasma-Therm into its nanotechnology fabrication lab, which supports multiple users engaged in wide-ranging nanotechnology research.

Full program for SEMI European MEMS Summit announced

08/24/2016  Leading companies will present the latest and most impactful trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September, 2016.

North American semiconductor equipment industry posts July 2016 book-to-bill ratio of 1.05

08/24/2016  North America-based manufacturers of semiconductor equipment posted $1.79 billion in orders worldwide in July 2016 (three-month average basis) and a book-to-bill ratio of 1.05.

Longtime SRC researcher Pradeep Lall wins NSF Award

08/23/2016  Pradeep Lall, John and Anne MacFarlane professor of mechanical engineering, has received a top award from the National Science Foundation’s Industry/University Cooperative Research Centers program.

Automotive MEMS market to thrive; China and India project lucrative growth

08/22/2016  A few major brands in the automotive MEMS market witnessed a regulatory blow in 2014-15, resulting in passive market dynamics. However, the market has recovered rapidly and is currently growing at a significant pace, according to new research recently published by Future Market Insights.

Natural scale caterpillar soft robot is powered and controlled with light

08/18/2016  Researchers at the Faculty of Physics at the University of Warsaw, using the liquid crystal elastomer technology, originally developed in the LENS Institute in Florence, demonstrated a bioinspired micro-robot capable of mimicking caterpillar gaits in natural scale.

Global silicon photonics market to grow at a CAGR of over 48% through 2020

08/18/2016  Technavio analysts forecast the global silicon photonics market to grow at an impressive CAGR of over 48% during the forecast period, according to their latest report.

Tokyo Electron Limited joins Semiconductor Research Corporation

08/16/2016  Semiconductor Research Corporation today announced that Tokyo Electron Limited has joined SRC's Nanomanufacturing Materials and Processes initiative.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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