MEMS

MEMS ARTICLES



IoT: Powering small devices

04/22/2016  Are the power solutions the IoT needs arriving quickly enough?

EU regulation update: What could impact the industry next?

04/20/2016  In a global industry, monitoring regulatory developments across different regions can be a challenge.

ams breaks ground on NY wafer fab

04/20/2016  ams AG (SIX: AMS) today took a step forward in its long-term strategy of increasing manufacturing capacity for its high-performance sensors and sensor solution integrated circuits (ICs), holding a groundbreaking event at the site of its new wafer fabrication plant in Utica, New York.

Energy harvesting to drive semiconductor sales to $3B by 2020

04/20/2016  The new Semico Research report "Energy Harvesting: The Next Billion Dollar Market for Semiconductors" projects semiconductor sales for this market will reach $3 billion by 2020.

UW-Madison engineers fabricate fastest flexible silicon transistor

04/20/2016  Working in collaboration with colleagues around the country, University of Wisconsin-Madison engineers have pioneered a unique method that could allow manufacturers to easily and cheaply fabricate high-performance transistors with wireless capabilities on huge rolls of flexible plastic.

14 IC product categories to exceed total IC market growth in 2016

04/19/2016  Cellphone App MPUs and Signal Conversion top the list; Tablet MPU growth stalls, DRAM tumbles.

New nanodevice shifts light's color at single-photon level

04/18/2016  Scientists at the National Institute of Standards and Technology (NIST) have now developed a miniaturized version of a frequency converter, using technology similar to that used to make computer chips.

Extended supply chain presents exhibitors with new opportunities at SEMICON West

04/18/2016  Leading innovators in today's integrated electronics supply chain are preparing to showcase their products and services at SEMICON West 2016 on July 12-14 in San Francisco, Calif.

IEEE International Electron Devices Meeting announces 2016 Call for Papers

04/15/2016  The 62nd annual IEEE International Electron Devices Meeting (IEDM), to be held at the San Francisco Union Square Hilton hotel December 3 - 7, 2016, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

MU, STMicroelectronics improve medical care with miniature ultrasound diagnostic device

04/14/2016  MU, a medical-device manufacturer, and STMicroelectronics today announced that MU's US-304 portable ultrasound imager, powered by ST's STHV800 pulser, is aiming to increase the quality of point-of-care medical diagnostics in remote rural areas of Africa.

Samco increases local sales staff for North American, European and Asian locations

04/14/2016  Samco, a Japan-based semiconductor process equipment developer and manufacturer, is employing around 20 more people at its locations in North America, China, Taiwan and Singapore, as well as its subsidiary Samco-UCP in Liechtenstein.

imec and Crystal Solar demonstrate 22.5% nPERT Si solar cells on kerfless epitaxial wafers

04/14/2016  Crystal Solar’s kerfless wafers are a disruptive solution for the solar cell industry, substantially reducing the cost of Si solar cells.

Imec Technology Forum Brussels puts nanotechnology in the hot seat

04/13/2016  Imec, the nanoelectronics research center, today announced that its annual Imec Technology Forum (ITF) in Brussels will take place May 24-25, 2016 in Brussels, Belgium at SQUARE, Brussels Meeting Centre

Tech companies creating strategic platforms to support the Internet of Things

04/12/2016  IHS forecasts that the IoT market will grow from an installed base of 15.4 billion devices in 2015 to 30.7 billion devices in 2020 and 75.4 billion in 2025.

New funding fuels ClassOne Technology's 2016 growth surge

04/12/2016  ClassOne Technology, manufacturer of cost-efficient Solstice electroplating systems, has announced the completion of a major new round of funding from Salem Investment Partners of Winston-Salem, North Carolina.

Sensors driving next-generation wearable devices

04/12/2016  Last week, IDTechEx gave the opening presentation at the 2016 Korea Summit for Smart Wearable Devices, excellently hosted by KDIA and KSA in Seoul, Korea.

Technavio updates on the global piezoelectric smart materials market

04/11/2016  According to their latest report, Technavio analysts expect the global piezoelectric smart materials market for 2016-2020 to exceed USD 42 billion by 2020 growing at a CAGR of almost 13 percent.

Leti and ARaymondlife launch project to speed use of microfluidic devices for biological sample analysis

04/07/2016  Leti, an Institute of CEA Tech, and ARaymondlife, a manufacturer of customized devices and consumables for the IVD industry today announced a joint initiative to accelerate the development and manufacturing of innovative medical devices, especially in the field of microfluidic cartridge analysis.

SIA's VP of Global Policy to address China's new role in the semiconductor industry at The ConFab 2016

04/06/2016  Solid State Technology is pleased to announced that Jimmy Goodrich of the Semiconductor Industry Association is the latest distinguished guest confirmed to speak at The ConFab 2016.

STMicroelectronics accelerates STM8 sales past two billion units

04/05/2016  STMicroelectronics has surpassed two billion unit sales of its robust and versatile STM8 microcontrollers, less than two years after reaching one billion unit sales, noting particularly strong success in China.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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