03/07/2016  Use your computer without the need to start it up: a new type of magnetic memory makes it possible. This "MRAM" is faster, more efficient and robust than other kinds of data storage. However, switching bits still requires too much electrical power to make large-scale application practicable.

03/07/2016  EV Group (EVG) today announced that its EVG GEMINI 300mm automated wafer bonding system is ready for implementation into MEMS high-volume manufacturing.

03/04/2016  Mutricy succeeds Mike Cadigan, who will transition to a newly created role as senior vice president of global sales and business development.

03/03/2016  Gartner, Inc. has highlighted the top 10 Internet of Things (IoT) technologies that should be on every organization's radar through the next two years.

03/01/2016  ON Semiconductor Corporation has teamed up with RFMicron, Inc. to unveil multifaceted Internet of Things, or IoT, sensor platform supporting battery-free operation.

03/01/2016  STATS ChipPAC Ltd. today announced that it has been honored with the “Supplier of the Year” award from Inphi Corporation.

02/29/2016  EPFL researchers have developed conductive tracks that can be bent and stretched up to 4 times their original length; they could be used in artificial skin, connected clothing and on­-body sensors.

02/23/2016  NTU's new radar chip was presented and published at the prestigious International Solid-State Circuits Conference (ISSCC) 2016.

02/23/2016  Recent capital spending trends indicative of maturing semiconductor industry.

02/22/2016  Vesper today announced a partnership with AAC Technologies Holdings Inc. for the commercialization of the world’s first piezoelectric MEMS microphones for consumer electronic devices.

02/22/2016  Global smartphone sales exhibited slowest growth since 2008; iPhone sales declined for the first time.

02/22/2016  Nanoelectronics research center, imec, and digital research and incubation center, iMinds, announced that its respective board of directors have approved the intention to merge the research centers.

02/22/2016  Today, at the 2016 Mobile World Congress, Bosch Sensortec introduces its first generation of sensor hub products with optimized vital sensing features.

02/19/2016  Nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) present a frequency division duplex (FDD) balance network, capable of dual-frequency impedance tuning for all LTE bands in the 0.7-to-1GHz range.

02/18/2016  Researchers from Brown University's School of Engineering have made an important fundamental advance that could make such devices more practical.

02/17/2016  Mobile Experts released a new report today on Wi-Fi Semiconductors, highlighting the trends in combo chips, SoCs, power amplifiers, LNAs, switches, and Front End Modules (FEMs).

02/17/2016  EV Group (EVG) today announced that WIKA Group has placed an EVG HERCULES lithography track system into production for manufacturing pressure sensor devices.

02/15/2016  At this week's SPIE Photonics West, imec will present a new set of hyperspectral sensor and camera solutions with extended spectral range, going from the visible light (VIS) up to near infrared (NIR).

02/11/2016  Renesas Electronics Corp. reported the development of 90nm one-transistor MONOS (1T-MONOS) flash memory technology that can be used in combination with a variety of processes.

02/10/2016  SEMI announced today the launch of the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group.